DOI: 10.1109/33.180035. Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronic devices

Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronic devices

10.1109/33.180035

Crossref journal-article

Institute of Electrical and Electronics Engineers (IEEE)

IEEE Transactions on Components, Hybrids, and Manufacturing Technology (263)

Bibliography

Goodson, K. E., & Flik, M. I. (1992). Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronic devices. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(5), 715â722.

Authors 2

K.E. Goodson (first)
M.I. Flik (additional)

References 14 Referenced 56

10.1109/ICMTS.1989.39295
{'key': 'ref11', 'article-title': 'Microscale phonon transport in dielectrics and intrinsic semiconductors', 'author': 'goodson', 'year': '1992', 'journal-title': 'ASME Winter Ann Meeting'} / ASME Winter Ann Meeting / Microscale phonon transport in dielectrics and intrinsic semiconductors by goodson (1992)
10.1109/IEDM.1989.74179
{'key': 'ref13', 'first-page': '31', 'author': 'muller', 'year': '1986', 'journal-title': 'Device Electronics for Integrated Circuits'} / Device Electronics for Integrated Circuits by muller (1986)
10.1103/RevModPhys.61.605
{'key': 'ref4', 'first-page': '115', 'author': 'kittel', 'year': '1986', 'journal-title': 'Introduction to Solid State Physics'} / Introduction to Solid State Physics by kittel (1986)
10.1115/1.2910494
{'key': 'ref6', 'first-page': '80', 'author': 'marcus', 'year': '1983', 'journal-title': 'Transmission Electron Microscopy of Silicon VLSI Circuits and Structures'} / Transmission Electron Microscopy of Silicon VLSI Circuits and Structures by marcus (1983)
{'key': 'ref5', 'first-page': '9', 'volume': '1', 'author': 'touloukian', 'year': '1970', 'journal-title': 'Thermophysical Properties of Matter'} / Thermophysical Properties of Matter by touloukian (1970)
{'key': 'ref8', 'first-page': '193', 'volume': '2', 'author': 'touloukian', 'year': '1970', 'journal-title': 'Thermophysical Properties of Matter'} / Thermophysical Properties of Matter by touloukian (1970)
{'key': 'ref7', 'first-page': '204', 'volume': '4', 'author': 'touloukian', 'year': '1970', 'journal-title': 'Thermophysical Properties of Matter'} / Thermophysical Properties of Matter by touloukian (1970)
10.1115/1.2911332
10.1007/978-1-4757-2121-8_5
{'key': 'ref9', 'first-page': '202', 'volume': '5', 'author': 'touloukian', 'year': '0', 'journal-title': 'Thermophysical Properties of Matter'} / Thermophysical Properties of Matter by touloukian (0)

Dates

Type	When
Created	22 years, 11 months ago (Aug. 24, 2002, 7:09 p.m.)
Deposited	3 years, 8 months ago (Nov. 29, 2021, 3:06 p.m.)
Indexed	3 months, 1 week ago (May 9, 2025, 6:46 a.m.)
Issued	33 years, 7 months ago (Jan. 1, 1992)
Published	33 years, 7 months ago (Jan. 1, 1992)
Published Print	33 years, 7 months ago (Jan. 1, 1992)

Funders 0

None

BibTeX

@article{Goodson_1992, title={Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronic devices}, volume={15}, ISSN={0148-6411}, url={http://dx.doi.org/10.1109/33.180035}, DOI={10.1109/33.180035}, number={5}, journal={IEEE Transactions on Components, Hybrids, and Manufacturing Technology}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Goodson, K.E. and Flik, M.I.}, year={1992}, pages={715–722} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2025,
        5,
        9
      ]
    ],
    "date-time": "2025-05-09T10:46:36Z",
    "timestamp": 1746787596417
  },
  "reference-count": 14,
  "publisher": "Institute of Electrical and Electronics Engineers (IEEE)",
  "issue": "5",
  "license": [
    {
      "start": {
        "date-parts": [
          [
            1992,
            1,
            1
          ]
        ],
        "date-time": "1992-01-01T00:00:00Z",
        "timestamp": 694224000000
      },
      "content-version": "vor",
      "delay-in-days": 0,
      "URL": "https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html"
    }
  ],
  "content-domain": {
    "domain": [],
    "crossmark-restriction": false
  },
  "published-print": {
    "date-parts": [
      [
        1992
      ]
    ]
  },
  "DOI": "10.1109/33.180035",
  "type": "journal-article",
  "created": {
    "date-parts": [
      [
        2002,
        8,
        24
      ]
    ],
    "date-time": "2002-08-24T23:09:11Z",
    "timestamp": 1030230551000
  },
  "page": "715-722",
  "source": "Crossref",
  "is-referenced-by-count": 56,
  "title": "Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronic devices",
  "prefix": "10.1109",
  "volume": "15",
  "author": [
    {
      "given": "K.E.",
      "family": "Goodson",
      "sequence": "first",
      "affiliation": []
    },
    {
      "given": "M.I.",
      "family": "Flik",
      "sequence": "additional",
      "affiliation": []
    }
  ],
  "member": "263",
  "reference": [
    {
      "key": "ref10",
      "doi-asserted-by": "publisher",
      "DOI": "10.1109/ICMTS.1989.39295"
    },
    {
      "key": "ref11",
      "article-title": "Microscale phonon transport in dielectrics and intrinsic semiconductors",
      "author": "goodson",
      "year": "1992",
      "journal-title": "ASME Winter Ann Meeting"
    },
    {
      "key": "ref12",
      "doi-asserted-by": "publisher",
      "DOI": "10.1109/IEDM.1989.74179"
    },
    {
      "key": "ref13",
      "first-page": "31",
      "author": "muller",
      "year": "1986",
      "journal-title": "Device Electronics for Integrated Circuits"
    },
    {
      "key": "ref14",
      "doi-asserted-by": "publisher",
      "DOI": "10.1103/RevModPhys.61.605"
    },
    {
      "key": "ref4",
      "first-page": "115",
      "author": "kittel",
      "year": "1986",
      "journal-title": "Introduction to Solid State Physics"
    },
    {
      "key": "ref3",
      "doi-asserted-by": "publisher",
      "DOI": "10.1115/1.2910494"
    },
    {
      "key": "ref6",
      "first-page": "80",
      "author": "marcus",
      "year": "1983",
      "journal-title": "Transmission Electron Microscopy of Silicon VLSI Circuits and Structures"
    },
    {
      "key": "ref5",
      "first-page": "9",
      "volume": "1",
      "author": "touloukian",
      "year": "1970",
      "journal-title": "Thermophysical Properties of Matter"
    },
    {
      "key": "ref8",
      "first-page": "193",
      "volume": "2",
      "author": "touloukian",
      "year": "1970",
      "journal-title": "Thermophysical Properties of Matter"
    },
    {
      "key": "ref7",
      "first-page": "204",
      "volume": "4",
      "author": "touloukian",
      "year": "1970",
      "journal-title": "Thermophysical Properties of Matter"
    },
    {
      "key": "ref2",
      "doi-asserted-by": "publisher",
      "DOI": "10.1115/1.2911332"
    },
    {
      "key": "ref1",
      "doi-asserted-by": "publisher",
      "DOI": "10.1007/978-1-4757-2121-8_5"
    },
    {
      "key": "ref9",
      "first-page": "202",
      "volume": "5",
      "author": "touloukian",
      "year": "0",
      "journal-title": "Thermophysical Properties of Matter"
    }
  ],
  "container-title": "IEEE Transactions on Components, Hybrids, and Manufacturing Technology",
  "original-title": [],
  "link": [
    {
      "URL": "http://xplorestaging.ieee.org/ielx1/33/4507/00180035.pdf?arnumber=180035",
      "content-type": "unspecified",
      "content-version": "vor",
      "intended-application": "similarity-checking"
    }
  ],
  "deposited": {
    "date-parts": [
      [
        2021,
        11,
        29
      ]
    ],
    "date-time": "2021-11-29T20:06:01Z",
    "timestamp": 1638216361000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "http://ieeexplore.ieee.org/document/180035/"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        1992
      ]
    ]
  },
  "references-count": 14,
  "journal-issue": {
    "issue": "5"
  },
  "URL": "http://dx.doi.org/10.1109/33.180035",
  "relation": {},
  "ISSN": [
    "0148-6411"
  ],
  "subject": [],
  "container-title-short": "IEEE Trans. Comp., Hybrids, Manufact. Technol.",
  "published": {
    "date-parts": [
      [
        1992
      ]
    ]
  }
}