Crossref
journal-article
Institute of Electrical and Electronics Engineers (IEEE)
IEEE Transactions on Electron Devices (263)
References
24
Referenced
97
{'key': 'ref10', 'first-page': '17', 'article-title': 'Study of boron penetration through thin oxide with p<superscript>+</superscript> polsilicon gate', 'author': 'sun', 'year': '0', 'journal-title': 'Proc 1989 VLSI Symp'}
/ Proc 1989 VLSI Symp / Study of boron penetration through thin oxide with p<superscript>+</superscript> polsilicon gate by sun (0)10.1109/T-ED.1977.18712
{'key': 'ref12', 'first-page': '238', 'article-title': 'Doping of n<superscript>+</superscript> and p<superscript>+</superscript> polysilicon in a dual-gate CMOS process', 'author': 'wong', 'year': '1988', 'journal-title': 'IEDM Tech Dig'}
/ IEDM Tech Dig / Doping of n<superscript>+</superscript> and p<superscript>+</superscript> polysilicon in a dual-gate CMOS process by wong (1988){'key': 'ref13', 'first-page': '52', 'article-title': '0.5 micron CMOS for high performance at 3.3 V', 'author': 'r', 'year': '1988', 'journal-title': 'IEDM Tech Dig'}
/ IEDM Tech Dig / 0.5 micron CMOS for high performance at 3.3 V by r (1988)10.1109/IEDM.1989.74231
{'key': 'ref15', 'first-page': '532', 'author': 'sah', 'year': '1988', 'journal-title': 'Properties of Silicon'}
/ Properties of Silicon by sah (1988)10.1109/IEDM.1986.191162
/ 1986 International Electron Devices Meeting / a symmetric submicron cmos technology by hillenius (1986){'key': 'ref17', 'first-page': '368', 'article-title': 'Very shallow junctions for submicron CMOS technology using implanted Ti for salicidation', 'author': 'davari', 'year': '1987', 'journal-title': 'VLSI Sci Tech Dig'}
/ VLSI Sci Tech Dig / Very shallow junctions for submicron CMOS technology using implanted Ti for salicidation by davari (1987)10.1109/T-ED.1987.22965
/ IEEE Transactions on Electron Devices / source—drain contact resistance in cmos with self-aligned tisi<inf>2</inf> by taur (1987){'key': 'ref19', 'first-page': '254', 'article-title': 'The use of TiSi<subscript>2</subscript> in a selfaligned silicide technology', 'author': 'ting', 'year': '1982', 'journal-title': 'VLSI Sci Tech Dig'}
/ VLSI Sci Tech Dig / The use of TiSi<subscript>2</subscript> in a selfaligned silicide technology by ting (1982){'key': 'ref4', 'year': '0'}
(0){'key': 'ref3', 'first-page': '21', 'article-title': '0.5 ?m CMOS device design and characterization', 'author': 'hanafi', 'year': '0', 'journal-title': 'Proc ESSDERC 87'}
/ Proc ESSDERC 87 / 0.5 ?m CMOS device design and characterization by hanafi (0){'key': 'ref6', 'first-page': '61', 'article-title': 'Submicron tungsten gate MOSFET with 10 nm gate oxide', 'author': 'davari', 'year': '0', 'journal-title': 'Proc 1987 Symp VLSI Technology'}
/ Proc 1987 Symp VLSI Technology / Submicron tungsten gate MOSFET with 10 nm gate oxide by davari (0)10.1109/IEDM.1987.191506
/ 1987 International Electron Devices Meeting / design methodology for deep submicron cmos by tanaka (1987){'key': 'ref8', 'first-page': '381', 'article-title': 'Use of thin TiSi<subscript>2</subscript> for submicron VLSI CMOS', 'volume': '87 11', 'author': 'moy', 'year': '1987', 'journal-title': 'Proc 2nd Int Symp VLSI Science and Technology'}
/ Proc 2nd Int Symp VLSI Science and Technology / Use of thin TiSi<subscript>2</subscript> for submicron VLSI CMOS by moy (1987)10.1109/T-ED.1987.22956
/ IEEE Transactions on Electron Devices / the impact of intrinsic series resistance on mosfet scaling by ng (1987)10.1109/16.127490
10.1109/JSSC.1974.1050511
10.1117/12.968305
10.1116/1.572576
10.1116/1.582941
{'key': 'ref21', 'article-title': 'Substrate and dopant effects on the formation of TiSi<subscript>2</subscript>', 'author': 'basavaiah', 'year': '1986', 'journal-title': 'Proc Mat Res Soc'}
/ Proc Mat Res Soc / Substrate and dopant effects on the formation of TiSi<subscript>2</subscript> by basavaiah (1986)10.1109/IEDM.1987.191530
/ 1987 International Electron Devices Meeting / corner-field induced drain leakage in thin oxide mosfets by chang (1987)10.1016/0040-6090(80)90086-3
Dates
Type | When |
---|---|
Created | 22 years, 11 months ago (Aug. 24, 2002, 4:40 p.m.) |
Deposited | 3 years, 8 months ago (Nov. 29, 2021, 2:08 p.m.) |
Indexed | 5 months ago (March 22, 2025, 4:34 a.m.) |
Issued | 33 years, 4 months ago (April 1, 1992) |
Published | 33 years, 4 months ago (April 1, 1992) |
Published Print | 33 years, 4 months ago (April 1, 1992) |
@article{Davari_1992, title={A high-performance 0.25- mu m CMOS technology. II. Technology}, volume={39}, ISSN={0018-9383}, url={http://dx.doi.org/10.1109/16.127490}, DOI={10.1109/16.127490}, number={4}, journal={IEEE Transactions on Electron Devices}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Davari, B. and Chang, W.H. and Petrillo, K.E. and Wong, C.Y. and Moy, D. and Taur, Y. and Wordeman, M.R. and Sun, J.Y.-C. and Hsu, C.C.-H. and Polcari, M.R.}, year={1992}, month=apr, pages={967–975} }