DOI: 10.1108/03056120010378806. Metallurgy and performance of electrodeposited copper for flexible circuits

Metallurgy and performance of electrodeposited copper for flexible circuits

10.1108/03056120010378806

Crossref journal-article

Emerald

Circuit World (140)

Abstract

In this paper, we consider intrinsic properties of copper electrodeposited as plateup on polyimide substrate, thermal response of electrodeposited copper and fatigue performance of copper and copper/polyimide construction. The critical material characteristics examined are grain morphology and structure, crystallographic texture, microhardness, uniaxial strength and ductility and isothermal cyclic fatigue life. Given optimum processing conditions, copper plateup in flexible circuits displays fine grain structure, high ductility, adequate thermal stability, freedom from thermal embrittlement and excellent fatigue endurance over a wide range of strain amplitudes.

Bibliography

Merchant, H. D., Wang, J. T., Giannuzzi, L. A., & Liu, Y. L. (2000). Metallurgy and performance of electrodeposited copper for flexible circuits. Circuit World, 26(4), 7â14.

Authors 4

H.D. Merchant (first)
J.T. Wang (additional)
L.A. Giannuzzi (additional)
Y.L. Liu (additional)

References 26 Referenced 19

Ahn, E.C., Jin, Y. and Park, I.S. (1996), “Materials in Electronics”, J. Mat. Sci., Vol. 7, pp. 175‐9. (10.1007/BF00133111)
Bergstresser, T.R. and Merchant, H.D. (1995), Defect Structure, Morphology and Properties of Deposits, TMS, Warrendale, PA, pp. 115‐67.
Chen, P.C., Blackwell, K.J and Knoll, A.R. (1993), Proc. Fifth Int. Tab/Advanced Packaging Symp., ITAP ’93, Semiconductor Technol. Center, Neffs, PA, pp. 85‐91.
Chung, T.G., Kim, Y.H. and Yu, J. (1994), J. Adhesion Sci. Technol., Vol. 8, pp. 41‐51. (10.1163/156856194X00041)
Cummings, J.P., Jensen, R.J, Kompelien, D.J. and Moravec, T.J. (1982), Proc. Electron Components Conf., Vol. 32, pp. 465‐70.
DeAngelis, R.J., Knorr, D.B. and Merchant, H.D. (1995), J. Electron. Mater., Vol. 24, pp. 927‐33. (10.1007/BF02652963)
Egitto, F.D., Matienzo, L.J., Blackwell, K.J. and Knoll, A.R. (1994), J. Adhesion Sci. Technol., Vol. 8, pp. 411‐33. (10.1163/156856194X00311)
Estes, R.H. and Kulesza, F.W. (1983), Int. J. Hybrid Microelectron, Vol. 15, pp. 336‐40.
Fronz, V. (1991), Circuit World, Vol. 117, pp. 15‐18. (10.1108/eb046142)
Giannuzzi, L.A. (1996), Microstructural Sci., Vol. 24, pp. 87‐91.
Inagaki, N., Tasaka, S. and Hibi, K. (1994), J. Adhesion Sci. Technol., Vol. 8, pp. 395‐410. (10.1163/156856194X00302)
Iwamori, S. (1997), J. Adhesion Sci. Technol., Vol. 11, pp. 783‐95. (10.1163/156856197X00912)
Jiang, H., Chou, B. and Beilin, S. (1998), Int. Conf., Multichip Modules and High Density Packaging, IEEE, New York, NY, pp. 7‐12.
Joh, C.H., Kim, Y.H., Oh, T.S.,Park, I.S. and Yu, J. (1996), J. Korean Inst. Surf. Eng., Vol. 29, pp. 379‐85.
Junginger, R. and Elsner, G. (1988), J. Electroch. Soc., Vol. 135, pp. 2305‐08. (10.1149/1.2096258)
LeGoues, F.K., Silverman, B.D. and Ho, P.S. (1988), J. Vac. Sci. Technol., Vol. A6, pp. 2200‐04. (10.1116/1.575011)
Macionczyk, F., Bruckner, W., Pitschke, W. and Reiss, G. (1996), J. Mat. Res., Vol. 13, pp. 2852‐8. (10.1557/JMR.1998.0390)
Merchant, H.D. (1993), J. Electron. Mater., Vol. 22, pp. 631‐8. (10.1007/BF02666409)
Merchant, H.D. (1995), J. Electron. Mater., Vol. 24, pp. 919‐25. (10.1007/BF02652962)
Merchant, H.D. (1997), J. Electron. Mater., Vol. 26, pp. 833‐8. (10.1007/s11664-997-0259-5)
Merchant, H.D., Minor, M.G. and Liu, Y.L. (1999), J. Electron. Mater., Vol. 28, pp. 997‐1007. (10.1007/s11664-999-0176-x)
Pappas, D.L. and Cuomo, J.J. (1991), J. Vac. Sci. Technol, Vol. A9, pp. 2704‐08. (10.1116/1.577228)
Park, I.S. and Yu, J. (1998), Acta Mater., Vol. 46, pp. 2947‐53. (10.1016/S1359-6454(97)00208-5)
Tromp, R.M., Legoues, F. and Ho, P.S. (1985), J. Vac. Sci. Technol., Vol. A3, pp. 782‐5 (10.1116/1.573308)
Weale, R.D., Matienzo, L.J., Blackwell, K.J., Johnson, C. and Deliman, S (1993), Proc., 36th Annual Technical Conf., Soc. of Vacuum Coaters, Baltimore, MD, pp. 242‐7.
Weale, R.D., Matienzo, L.J., Blackwell, K.J. and Knoll, A.K. (1992), Proc., 35th Annual Technical Conf., Soc. of Vacuum Coaters, Baltimore, MD, pp. 70‐5.

Dates

Type	When
Created	18 years, 4 months ago (April 13, 2007, 6:13 a.m.)
Deposited	3 weeks, 6 days ago (July 24, 2025, 8 p.m.)
Indexed	2 weeks, 4 days ago (Aug. 2, 2025, 1:58 p.m.)
Issued	24 years, 8 months ago (Dec. 1, 2000)
Published	24 years, 8 months ago (Dec. 1, 2000)
Published Print	24 years, 8 months ago (Dec. 1, 2000)

Funders 0

None

BibTeX

@article{Merchant_2000, title={Metallurgy and performance of electrodeposited copper for flexible circuits}, volume={26}, ISSN={0305-6120}, url={http://dx.doi.org/10.1108/03056120010378806}, DOI={10.1108/03056120010378806}, number={4}, journal={Circuit World}, publisher={Emerald}, author={Merchant, H.D. and Wang, J.T. and Giannuzzi, L.A. and Liu, Y.L.}, year={2000}, month=dec, pages={7–14} }

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