DOI: 10.1088/0960-1317/15/11/025. Self-assembly for three-dimensional integration of functional electrical components

Self-assembly for three-dimensional integration of functional electrical components

10.1088/0960-1317/15/11/025

Crossref journal-article

IOP Publishing

Journal of Micromechanics and Microengineering (266)

Bibliography

Cannon, A. H., Hua, Y., Henderson, C. L., & King, W. P. (2005). Self-assembly for three-dimensional integration of functional electrical components. Journal of Micromechanics and Microengineering, 15(11), 2172â2178.

Authors 4

Andrew H Cannon (first)
Yueming Hua (additional)
Clifford L Henderson (additional)
William P King (additional)

References 25 Referenced 14

{'key': '1', 'author': 'Alien Technology Corporation', 'year': '1999'} by Alien Technology Corporation (1999)
10.1109/JMEMS.2003.809964
10.1002/1616-3028(200110)11:5<381::AID-ADFM381>3.3.CO;2-V
10.1021/ja020056o
10.1126/science.1070821
10.1109/84.911087
10.1126/science.289.5482.1170
10.1038/35016528
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10.1109/JMEMS.2003.811724
10.1126/science.276.5310.233
{'key': '12', 'first-page': '156', 'author': 'Tummala R R', 'year': '1997', 'journal-title': 'Microelectronics Packaging Handbook: Semiconductor Packaging Part II'} / Microelectronics Packaging Handbook: Semiconductor Packaging Part II by Tummala R R (1997)
{'key': '13', 'first-page': '452', 'author': 'Madou M J', 'year': '2002', 'journal-title': 'Fundamentals of Microfabrication: The Science of Miniaturization'} / Fundamentals of Microfabrication: The Science of Miniaturization by Madou M J (2002)
10.1126/science.1069153
10.1088/0960-1317/13/4/301 / J. Micromech. Microeng. by Böhringer K F (2003)
{'key': '16', 'author': 'Böhringer K F Srinivasan U Howe R T', 'year': '2001', 'journal-title': '14th IEEE Int. Conf. MEMS 2001'} / 14th IEEE Int. Conf. MEMS 2001 by Böhringer K F Srinivasan U Howe R T (2001)
{'key': '17', 'author': 'Greiner A Lienemann J Korvink J G Xiong X Hanein Y Böhringer K F', 'year': '2002', 'journal-title': "5th Int. Conf. on Modeling and Simulation of Microsystems (MSM'02)"} / 5th Int. Conf. on Modeling and Simulation of Microsystems (MSM'02) by Greiner A Lienemann J Korvink J G Xiong X Hanein Y Böhringer K F (2002)
{'key': '18', 'first-page': '592', 'author': 'Liang S-H Wang K Böhringer K F', 'year': '2005', 'journal-title': '18th IEEE Int. Conf. on Micro Electro Mechanical Systems'} / 18th IEEE Int. Conf. on Micro Electro Mechanical Systems by Liang S-H Wang K Böhringer K F (2005)
10.1016/S1526-6125(04)70058-4 / J. Manuf. Process. by Kladitis P E (2004)
10.1126/science.284.5416.948
10.1109/MEMSYS.2005.1453854 / 18th IEEE Int. Conf. on Micro Electro Mechanical Systems by Zheng W Chung J Jacobs H O (2005)
10.1063/1.1807017
10.1073/pnas.0404437101
10.1002/adfm.200400595
{'key': '25', 'author': ''}

Dates

Type	When
Created	19 years, 10 months ago (Oct. 17, 2005, 11:13 p.m.)
Deposited	5 years, 4 months ago (April 11, 2020, 4:39 a.m.)
Indexed	1 year, 7 months ago (Jan. 25, 2024, 1:22 p.m.)
Issued	19 years, 10 months ago (Oct. 17, 2005)
Published	19 years, 10 months ago (Oct. 17, 2005)
Published Online	19 years, 10 months ago (Oct. 17, 2005)
Published Print	19 years, 10 months ago (Nov. 1, 2005)

Funders 0

None

BibTeX

@article{Cannon_2005, title={Self-assembly for three-dimensional integration of functional electrical components}, volume={15}, ISSN={1361-6439}, url={http://dx.doi.org/10.1088/0960-1317/15/11/025}, DOI={10.1088/0960-1317/15/11/025}, number={11}, journal={Journal of Micromechanics and Microengineering}, publisher={IOP Publishing}, author={Cannon, Andrew H and Hua, Yueming and Henderson, Clifford L and King, William P}, year={2005}, month=oct, pages={2172–2178} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2024,
        1,
        25
      ]
    ],
    "date-time": "2024-01-25T18:22:09Z",
    "timestamp": 1706206929430
  },
  "reference-count": 25,
  "publisher": "IOP Publishing",
  "issue": "11",
  "content-domain": {
    "domain": [],
    "crossmark-restriction": false
  },
  "published-print": {
    "date-parts": [
      [
        2005,
        11,
        1
      ]
    ]
  },
  "DOI": "10.1088/0960-1317/15/11/025",
  "type": "journal-article",
  "created": {
    "date-parts": [
      [
        2005,
        10,
        18
      ]
    ],
    "date-time": "2005-10-18T03:13:43Z",
    "timestamp": 1129605223000
  },
  "page": "2172-2178",
  "source": "Crossref",
  "is-referenced-by-count": 14,
  "title": "Self-assembly for three-dimensional integration of functional electrical components",
  "prefix": "10.1088",
  "volume": "15",
  "author": [
    {
      "given": "Andrew H",
      "family": "Cannon",
      "sequence": "first",
      "affiliation": []
    },
    {
      "given": "Yueming",
      "family": "Hua",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "Clifford L",
      "family": "Henderson",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "William P",
      "family": "King",
      "sequence": "additional",
      "affiliation": []
    }
  ],
  "member": "266",
  "published-online": {
    "date-parts": [
      [
        2005,
        10,
        17
      ]
    ]
  },
  "reference": [
    {
      "key": "1",
      "author": "Alien Technology Corporation",
      "year": "1999"
    },
    {
      "key": "2",
      "doi-asserted-by": "publisher",
      "DOI": "10.1109/JMEMS.2003.809964"
    },
    {
      "key": "3",
      "doi-asserted-by": "publisher",
      "DOI": "10.1002/1616-3028(200110)11:5<381::AID-ADFM381>3.3.CO;2-V"
    },
    {
      "key": "4",
      "doi-asserted-by": "publisher",
      "DOI": "10.1021/ja020056o"
    },
    {
      "key": "5",
      "doi-asserted-by": "publisher",
      "DOI": "10.1126/science.1070821"
    },
    {
      "key": "6",
      "doi-asserted-by": "publisher",
      "DOI": "10.1109/84.911087"
    },
    {
      "key": "7",
      "doi-asserted-by": "publisher",
      "DOI": "10.1126/science.289.5482.1170"
    },
    {
      "key": "8",
      "doi-asserted-by": "publisher",
      "DOI": "10.1038/35016528"
    },
    {
      "key": "9",
      "doi-asserted-by": "publisher",
      "DOI": "10.1002/1521-4095(20020205)14:3<235::AID-ADMA235>3.0.CO;2-B"
    },
    {
      "key": "10",
      "doi-asserted-by": "publisher",
      "DOI": "10.1109/JMEMS.2003.811724"
    },
    {
      "key": "11",
      "doi-asserted-by": "publisher",
      "DOI": "10.1126/science.276.5310.233"
    },
    {
      "key": "12",
      "first-page": "156",
      "author": "Tummala R R",
      "year": "1997",
      "journal-title": "Microelectronics Packaging Handbook: Semiconductor Packaging Part II"
    },
    {
      "key": "13",
      "first-page": "452",
      "author": "Madou M J",
      "year": "2002",
      "journal-title": "Fundamentals of Microfabrication: The Science of Miniaturization"
    },
    {
      "key": "14",
      "doi-asserted-by": "publisher",
      "DOI": "10.1126/science.1069153"
    },
    {
      "key": "15",
      "doi-asserted-by": "crossref",
      "first-page": "S1",
      "DOI": "10.1088/0960-1317/13/4/301",
      "volume": "13",
      "author": "B\u00f6hringer K F",
      "year": "2003",
      "journal-title": "J. Micromech. Microeng.",
      "ISSN": "http://id.crossref.org/issn/0960-1317",
      "issn-type": "print"
    },
    {
      "key": "16",
      "author": "B\u00f6hringer K F Srinivasan U Howe R T",
      "year": "2001",
      "journal-title": "14th IEEE Int. Conf. MEMS 2001"
    },
    {
      "key": "17",
      "author": "Greiner A Lienemann J Korvink J G Xiong X Hanein Y B\u00f6hringer K F",
      "year": "2002",
      "journal-title": "5th Int. Conf. on Modeling and Simulation of Microsystems (MSM'02)"
    },
    {
      "key": "18",
      "first-page": "592",
      "author": "Liang S-H Wang K B\u00f6hringer K F",
      "year": "2005",
      "journal-title": "18th IEEE Int. Conf. on Micro Electro Mechanical Systems"
    },
    {
      "key": "19",
      "doi-asserted-by": "crossref",
      "first-page": "32",
      "DOI": "10.1016/S1526-6125(04)70058-4",
      "volume": "6",
      "author": "Kladitis P E",
      "year": "2004",
      "journal-title": "J. Manuf. Process.",
      "ISSN": "http://id.crossref.org/issn/1526-6125",
      "issn-type": "print"
    },
    {
      "key": "20",
      "doi-asserted-by": "publisher",
      "DOI": "10.1126/science.284.5416.948"
    },
    {
      "key": "21",
      "doi-asserted-by": "crossref",
      "first-page": "8",
      "DOI": "10.1109/MEMSYS.2005.1453854",
      "author": "Zheng W Chung J Jacobs H O",
      "year": "2005",
      "journal-title": "18th IEEE Int. Conf. on Micro Electro Mechanical Systems"
    },
    {
      "key": "22",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.1807017"
    },
    {
      "key": "23",
      "doi-asserted-by": "publisher",
      "DOI": "10.1073/pnas.0404437101"
    },
    {
      "key": "24",
      "doi-asserted-by": "publisher",
      "DOI": "10.1002/adfm.200400595"
    },
    {
      "key": "25",
      "author": ""
    }
  ],
  "container-title": "Journal of Micromechanics and Microengineering",
  "original-title": [],
  "deposited": {
    "date-parts": [
      [
        2020,
        4,
        11
      ]
    ],
    "date-time": "2020-04-11T08:39:08Z",
    "timestamp": 1586594348000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "https://iopscience.iop.org/article/10.1088/0960-1317/15/11/025"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        2005,
        10,
        17
      ]
    ]
  },
  "references-count": 25,
  "journal-issue": {
    "issue": "11",
    "published-print": {
      "date-parts": [
        [
          2005,
          11,
          1
        ]
      ]
    }
  },
  "alternative-id": [
    "S0960-1317(05)03000-7"
  ],
  "URL": "http://dx.doi.org/10.1088/0960-1317/15/11/025",
  "relation": {},
  "ISSN": [
    "0960-1317",
    "1361-6439"
  ],
  "subject": [],
  "container-title-short": "J. Micromech. Microeng.",
  "published": {
    "date-parts": [
      [
        2005,
        10,
        17
      ]
    ]
  }
}