Adhesion–delamination phenomena at the surfaces and interfaces in microelectronics and MEMS structures and packaged devices
10.1088/0022-3727/44/3/034004
Crossref journal-article
IOP Publishing
Journal of Physics D: Applied Physics (266)
Abstract

Physico-chemical mechanisms of adhesion and debonding at the various surfaces and interfaces of semiconductor devices, integrated circuits and microelectromechanical systems are systematically examined, starting from chip manufacturing and traversing the process stages to the ultimate finished product. Sources of intrinsic and thermal stresses in these devices are pointed out. Thin film ohmic contacts to the devices call for careful attention. The role of an adhesion layer in multilayer metallization schemes is highlighted. In packaged devices, sites facing potential risks of delamination are indicated. As MEMS devices incorporate moving parts, there are additional issues due to adhesion of suspended structures to surfaces in the vicinity, both during chip fabrication and their subsequent operation. Proper surface treatments for preventing adhesion together with design considerations for overcoming stiction pave the way to reliable functioning of these devices. Adhesion–delamination issues in microelectronics and MEMS continue to pose significant challenges to both design and process engineers. This paper is an attempt to survey the adhesion characteristics of materials, their compatibilities and limitations and look at future research trends. In addition, it addresses some of the techniques for improved or reduced adhesion, as demanded by the situation. The paper encompasses fundamental aspects to contemporary applications.

Bibliography

Khanna, V. K. (2010). Adhesion–delamination phenomena at the surfaces and interfaces in microelectronics and MEMS structures and packaged devices. Journal of Physics D: Applied Physics, 44(3), 034004.

Authors 1
  1. V K Khanna (first)
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Dates
Type When
Created 14 years, 8 months ago (Dec. 22, 2010, 11:26 p.m.)
Deposited 2 years, 7 months ago (Feb. 7, 2023, 1:18 p.m.)
Indexed 3 weeks, 5 days ago (Aug. 12, 2025, 5:50 p.m.)
Issued 14 years, 8 months ago (Dec. 22, 2010)
Published 14 years, 8 months ago (Dec. 22, 2010)
Published Online 14 years, 8 months ago (Dec. 22, 2010)
Published Print 14 years, 7 months ago (Jan. 26, 2011)
Funders 0

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@article{Khanna_2010, title={Adhesion–delamination phenomena at the surfaces and interfaces in microelectronics and MEMS structures and packaged devices}, volume={44}, ISSN={1361-6463}, url={http://dx.doi.org/10.1088/0022-3727/44/3/034004}, DOI={10.1088/0022-3727/44/3/034004}, number={3}, journal={Journal of Physics D: Applied Physics}, publisher={IOP Publishing}, author={Khanna, V K}, year={2010}, month=dec, pages={034004} }