DOI: 10.1063/5.0003907. High coherence superconducting microwave cavities with indium bump bonding

High coherence superconducting microwave cavities with indium bump bonding

10.1063/5.0003907

Crossref journal-article

AIP Publishing

Applied Physics Letters (317)

Abstract

Low-loss cavities are important in building high-coherence superconducting quantum computers. Generating high-quality joints between parts is crucial for the realization of a scalable quantum computer using the circuit quantum electrodynamics (cQED) framework. In this paper, we adapt the technique of indium bump bonding to cQED to realize high-quality superconducting microwave joints between chips. We use this technique to fabricate compact superconducting cavities in the multilayer microwave integrated quantum circuit (MMIQC) architecture and achieve single photon quality factors over 300 × 106 or single-photon lifetimes approaching 5 ms. To quantify the performance of the resulting seam, we fabricate microwave stripline resonators in multiple sections connected by different numbers of bonds, resulting in a wide range of seam admittances. The measured quality factors combined with the designed seam admittances allow us to bound the conductance of the seam at gseam≥2×1010/(Ω m). Such a conductance should enable the construction of micromachined superconducting cavities with a quality factor of at least a billion. These results demonstrate the capability to construct very high-quality microwave structures within the MMIQC architecture.

Bibliography

Lei, C. U., Krayzman, L., Ganjam, S., Frunzio, L., & Schoelkopf, R. J. (2020). High coherence superconducting microwave cavities with indium bump bonding. Applied Physics Letters, 116(15).

Authors 5

Chan U Lei (first)
Lev Krayzman (additional)
Suhas Ganjam (additional)
Luigi Frunzio (additional)
Robert J. Schoelkopf (additional)

References 22 Referenced 33

10.1146/annurev-conmatphys-031119-050605 / Annu. Rev. Condens. Matter Phys. / Superconducting qubits: Current state of play (2020)
C. S. Wang, J. C. Curtis, B. J. Lester, Y. Zhang, Y. Y. Gao, J. Freeze, V. S. Batista, P. H. Vaccaro, I. L. Chuang, L. Frunzio et al., “Quantum simulation of molecular vibronic spectra on a superconducting bosonic processor,” arXiv:1908.03598 (2019). (10.1103/PhysRevX.10.021060)
10.1038/s41586-019-1040-7 / Nature / Error mitigation extends the computational reach of a noisy quantum processor (2019)
10.1103/PhysRevX.6.031007 / Phys. Rev. X / Scalable quantum simulation of molecular energies (2016)
10.1038/s41586-019-0897-9 / Nature / A dissipatively stabilized Mott insulator of photons (2019)
10.1038/s41586-019-1666-5 / Nature / Quantum supremacy using a programmable superconducting processor (2019)
10.1038/npjqi.2016.2 / npj Quantum Inf. / Multilayer microwave integrated quantum circuits for scalable quantum computing (2016)
10.1038/s41534-017-0044-0 / npj Quantum Inf. / 3D integrated superconducting qubits (2017)
10.1063/1.5014033 / Appl. Phys. Lett. / A method for building low loss multi-layer wiring for superconducting microwave devices (2018)
10.1063/1.4935541 / Appl. Phys. Lett. / Demonstration of superconducting micromachined cavities (2015)
10.1103/PhysRevApplied.7.044018 / Phys. Rev. Appl. / Micromachined integrated quantum circuit containing a superconducting qubit (2017)
10.1063/1.324620 / J. Appl. Phys. / Fabrication of a superconducting niobium cavity by the diffusion-bonding method (1978)
10.1109/TNS.1971.4325998 / IEEE Trans. Nucl. Sci. / Superconducting niobium cavity measurements at SLAC (1971)
10.1103/PhysRevApplied.13.034032 / Phys. Rev. Appl. / Three-dimensional superconducting resonators at T<20 mK with photon lifetimes up to τ=2 s (2020)
10.1007/s10909-018-2019-8 / J. Low Temp. Phys. / Fabrication of flexible superconducting wiring with high current-carrying capacity indium interconnects (2018)
{'volume-title': 'Microelectronic Packaging', 'year': '2004', 'key': '2023061804151257400_c16'} / Microelectronic Packaging (2004)
10.1088/2058-9565/aa94fc / Quantum Sci. Technol. / Qubit compatible superconducting interconnects (2018)
{'year': '2017', 'key': '2023061804151257400_c18', 'article-title': 'Superconducting caps for quantum integrated circuits'} / Superconducting caps for quantum integrated circuits (2017)
10.1063/1.5003169 / Appl. Phys. Lett. / Thermocompression bonding technology for multilayer superconducting quantum circuits (2017)
10.1063/1.4959241 / Appl. Phys. Lett. / An architecture for integrating planar and 3D CQED devices (2016)
10.1103/PhysRevApplied.5.044021 / Phys. Rev. Appl. / Planar multilayer circuit quantum electrodynamics (2016)
10.1103/PhysRevB.94.014506 / Phys. Rev. B / Quantum memory with millisecond coherence in circuit QED (2016)

Dates

Type	When
Created	5 years, 4 months ago (April 15, 2020, 8:24 a.m.)
Deposited	2 years, 2 months ago (June 18, 2023, 12:15 a.m.)
Indexed	2 weeks, 5 days ago (Aug. 2, 2025, 12:21 a.m.)
Issued	5 years, 4 months ago (April 13, 2020)
Published	5 years, 4 months ago (April 13, 2020)
Published Online	5 years, 4 months ago (April 15, 2020)
Published Print	5 years, 4 months ago (April 13, 2020)

Funders 2

Max Planck Research Award from the Alexander von Humboldt Foundation
U.S. Army Research Office 10.13039/100000183 Army Research Office
Region: Americas
gov (National government)
Labels5
1. U.S. Army Research Office
2. United States Army Research Office
3. U.S. Army Research Laboratory's Army Research Office
4. ARL's Army Research Office
5. ARO
Awards1
1. W911NF-18-1-0212

BibTeX

@article{Lei_2020, title={High coherence superconducting microwave cavities with indium bump bonding}, volume={116}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/5.0003907}, DOI={10.1063/5.0003907}, number={15}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Lei, Chan U and Krayzman, Lev and Ganjam, Suhas and Frunzio, Luigi and Schoelkopf, Robert J.}, year={2020}, month=apr }

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