Abstract
The diffusion of ion-implanted phosphorus in silicon during rapid thermal annealing has been studied. Depending on the implant dose, we find two distinct kinds of diffusion behavior. For low dose (1×1014 cm−2) P+-implanted Si, a profile redistribution is observed which becomes observable at 900 °C for annealing times of 10 s, but which is temperature independent in the range 800–1150 °C. This initial redistribution is much more rapid than conventional diffusion coefficient data would predict. For high dose (2×1015 cm−2) P+ implanted and short time (10 s) annealed Si, the dopant profile broadening is strongly temperature dependent. The experimental profiles are in this case in agreement with concentration enhanced diffusion profiles.
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Dates
Type | When |
---|---|
Created | 22 years, 6 months ago (Feb. 13, 2003, 4:54 p.m.) |
Deposited | 1 year, 7 months ago (Feb. 5, 2024, 9:22 a.m.) |
Indexed | 1 year, 6 months ago (March 7, 2024, 8:58 a.m.) |
Issued | 41 years ago (Aug. 15, 1984) |
Published | 41 years ago (Aug. 15, 1984) |
Published Print | 41 years ago (Aug. 15, 1984) |
@article{Oehrlein_1984, title={Diffusion of phosphorus during rapid thermal annealing of ion-implanted silicon}, volume={45}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.95242}, DOI={10.1063/1.95242}, number={4}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Oehrlein, G. S. and Cohen, S. A. and Sedgwick, T. O.}, year={1984}, month=aug, pages={417–419} }