Abstract
Crystal damage, caused by a 1015 11B/cm2 250-keV implant into epitaxial Hg0.64Cd0.36Te layers held at LN2 temperature, has been successfully annealed, as observed by MeV 4He ion channeling and Rutherford backscattering. The anneal consists of a thermal pulse of 250 °C for 8 s in air under a Si proximity cap. Secondary ion mass spectrometry (SIMS) data indicate that the boron did not diffuse during the anneal. An n-p junction was observed at a depth of 5.5 μm by electron beam induced current (EBIC) measurements. A diode fabricated on the layer exhibited a very sharp I-V curve with reverse breakdown occurring at 12 V and an R0A of ⩾107 Ω cm2 at 77 K.
References
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Dates
Type | When |
---|---|
Created | 22 years, 6 months ago (Feb. 13, 2003, 4:25 p.m.) |
Deposited | 1 year, 6 months ago (Feb. 5, 2024, 8:29 a.m.) |
Indexed | 1 year, 6 months ago (Feb. 5, 2024, 11:44 a.m.) |
Issued | 42 years, 10 months ago (Oct. 15, 1982) |
Published | 42 years, 10 months ago (Oct. 15, 1982) |
Published Print | 42 years, 10 months ago (Oct. 15, 1982) |
@article{Conway_1982, title={Thermal pulse annealing of boron-implanted HgCdTe}, volume={41}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.93665}, DOI={10.1063/1.93665}, number={8}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Conway, K. L. and Opyd, W. G. and Greiner, M. E. and Gibbons, J. F. and Sigmon, T. W. and Bubulac, L. O.}, year={1982}, month=oct, pages={750–752} }