DOI: 10.1063/1.4759286. Origins of thermal boundary conductance of interfaces involving organic semiconductors

Origins of thermal boundary conductance of interfaces involving organic semiconductors

10.1063/1.4759286

Crossref journal-article

AIP Publishing

Journal of Applied Physics (317)

Abstract

We measure the room temperature thermal conductance of interfaces between an archetypal organic semiconductor copper phthalocyanine (CuPc) and several metals (aluminum, gold, magnesium, and silver) using the 3−ω method. The measured thermal boundary conductance (TBC) scales with bonding strength at the CuPc-metal interface, a correlation that is supported by molecular dynamics (MD) simulation, allowing the extrapolation of the effective interface Young's modulus. The trend in modeled interface modulus is in agreement with that deduced from adhesion tests, e.g., approximately 2 GPa for CuPc-gold and CuPc-silver interfaces, comparable to the van der Waals interaction strength of the materials. Using MD simulations in which the effects on thermal transport can be studied as a function of interfacial bond strength only, we isolate the relative contribution of acoustic mismatch and interface bond strength to TBC. Furthermore, measurements and modeling of organic/organic (e.g., CuPc/C60) interfaces reveal that the TBC of this system is not as sensitive to bonding strength as the CuPc/metal system, due to a larger overlap in the phonon density of states in the low frequency regime, despite the weak bonding between organic layers.

Bibliography

Jin, Y., Shao, C., Kieffer, J., Pipe, K. P., & Shtein, M. (2012). Origins of thermal boundary conductance of interfaces involving organic semiconductors. Journal of Applied Physics, 112(9).

Authors 5

Yansha Jin (first)
Chen Shao (additional)
John Kieffer (additional)
Kevin P. Pipe (additional)
Max Shtein (additional)

References 35 Referenced 43

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Dates

Type	When
Created	12 years, 9 months ago (Nov. 5, 2012, 7:33 p.m.)
Deposited	2 years, 1 month ago (July 5, 2023, 2:16 p.m.)
Indexed	1 week ago (Aug. 19, 2025, 6:27 a.m.)
Issued	12 years, 9 months ago (Nov. 1, 2012)
Published	12 years, 9 months ago (Nov. 1, 2012)
Published Online	12 years, 9 months ago (Nov. 5, 2012)
Published Print	12 years, 9 months ago (Nov. 1, 2012)

Funders 0

None

BibTeX

@article{Jin_2012, title={Origins of thermal boundary conductance of interfaces involving organic semiconductors}, volume={112}, ISSN={1089-7550}, url={http://dx.doi.org/10.1063/1.4759286}, DOI={10.1063/1.4759286}, number={9}, journal={Journal of Applied Physics}, publisher={AIP Publishing}, author={Jin, Yansha and Shao, Chen and Kieffer, John and Pipe, Kevin P. and Shtein, Max}, year={2012}, month=nov }

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