Abstract
The microstructure evolution and the corresponding solid-state reactions that take place during the formation of the Pd–Ge ohmic contacts on GaAs were studied using constant-heating-rate differential calorimetry (DSC) and cross-sectional transmission electron microscopy (XTEM). DSC analysis at different scan rates was performed on Pd(20 nm)/Ge(150 nm)/Pd(50 nm) thin film stacks that were lifted off the substrate and four solid-state reactions were identified. Specimens heated at temperatures that coincide with the DSC peaks were quenched in a He atmosphere and the resulting microstructure was characterized by XTEM. Variable constant-heating-rate DSC experiments allowed us to determine the activation energy associated with each solid-state reaction by the Kissinger plot method. The results were as follows: for Pd:Ge interdiffuson, the activation energy Q=1.03 eV, for hexagonal Pd2Ge formation Q=1.12 eV, for orthorhombic PdGe formation Q=1.33 eV and for Ge crystallization Q=1.8 eV. Based on these correlations, the mechanisms that contribute to the formation of an optimal ohmic contact microstructure were identified.
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Dates
Type | When |
---|---|
Created | 23 years ago (July 26, 2002, 8:26 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 7, 2024, 12:13 a.m.) |
Indexed | 1 year, 6 months ago (Feb. 15, 2024, 6:39 a.m.) |
Issued | 26 years, 1 month ago (July 15, 1999) |
Published | 26 years, 1 month ago (July 15, 1999) |
Published Print | 26 years, 1 month ago (July 15, 1999) |
@article{Radulescu_1999, title={Microstructure evolution study of Pd–Ge ohmic contact formation on GaAs}, volume={86}, ISSN={1089-7550}, url={http://dx.doi.org/10.1063/1.370837}, DOI={10.1063/1.370837}, number={2}, journal={Journal of Applied Physics}, publisher={AIP Publishing}, author={Radulescu, F. and McCarthy, J. M.}, year={1999}, month=jul, pages={995–998} }