DOI: 10.1063/1.354073. Stress evolution due to electromigration in confined metal lines

Stress evolution due to electromigration in confined metal lines

10.1063/1.354073

Crossref journal-article

AIP Publishing

Journal of Applied Physics (317)

Abstract

Electromigration is an important concern in very large scale integrated circuits. In narrow, confined metal interconnects used at the chip level, the electromigration flux is resisted by the evolution of mechanical stresses in the interconnects. Solutions for the differential equation governing the evolution of back stresses are presented for several representative cases, and the solutions are discussed in the light of experimental as well as theoretical developments from the literature.

Bibliography

Korhonen, M. A., Bo/rgesen, P., Tu, K. N., & Li, C.-Y. (1993). Stress evolution due to electromigration in confined metal lines. Journal of Applied Physics, 73(8), 3790â3799.

Authors 4

M. A. Korhonen (first)
P. Bo/rgesen (additional)
K. N. Tu (additional)
Che-Yu Li (additional)

References 37 Referenced 657

{'key': '2024020416412753400_r1'}
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Dates

Type	When
Created	23 years, 1 month ago (July 26, 2002, 9:46 a.m.)
Deposited	1 year, 6 months ago (Feb. 4, 2024, 11:41 a.m.)
Indexed	1 day, 21 hours ago (Aug. 28, 2025, 8:27 a.m.)
Issued	32 years, 4 months ago (April 15, 1993)
Published	32 years, 4 months ago (April 15, 1993)
Published Print	32 years, 4 months ago (April 15, 1993)

Funders 0

None

BibTeX

@article{Korhonen_1993, title={Stress evolution due to electromigration in confined metal lines}, volume={73}, ISSN={1089-7550}, url={http://dx.doi.org/10.1063/1.354073}, DOI={10.1063/1.354073}, number={8}, journal={Journal of Applied Physics}, publisher={AIP Publishing}, author={Korhonen, M. A. and Bo/rgesen, P. and Tu, K. N. and Li, Che-Yu}, year={1993}, month=apr, pages={3790–3799} }

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