DOI: 10.1063/1.351484. Slit morphology of electromigration induced open circuit failures in fine line conductors

Slit morphology of electromigration induced open circuit failures in fine line conductors

10.1063/1.351484

Crossref journal-article

AIP Publishing

Journal of Applied Physics (317)

Abstract

Detailed transmission and scanning electron microscopic images of electromigration-induced open circuit failures are presented for fine line aluminum alloy thin film interconnects. A characteristic slit open circuit, similar to stress migration open circuits in narrow interconnects, is shown for various film compositions, processing, and deposition conditions. It is suggested that slit failure morphology is more generally observed for low (≊1) ratios of conductor line width to film grain size. The slit failures observed often occur near copper rich precipitates. The morphology of several slit voids suggests that they are transgranular across the linewidth, consistent with other recent reports of electromigration induced damage in single crystal interconnects.

Bibliography

Sanchez, J. E., McKnelly, L. T., & Morris, J. W. (1992). Slit morphology of electromigration induced open circuit failures in fine line conductors. Journal of Applied Physics, 72(7), 3201â3203.

Authors 3

John E. Sanchez (first)
L. T. McKnelly (additional)
J. W. Morris (additional)

References 24 Referenced 52

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{'key': '2024020415574113700_r2'}
{'key': '2024020415574113700_r3'}
10.1063/1.345411 / J. Appl. Phys. (1990)
{'key': '2024020415574113700_r5'}
{'key': '2024020415574113700_r6'}
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{'key': '2024020415574113700_r8'}
10.1063/1.1755127 / Appl. Phys. Lett. (1967)
10.1063/1.1657425 / J. Appl. Phys. (1969)
10.1016/0040-6090(69)90035-2 / Thin Solid Films (1969)
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10.1016/0025-5416(72)90082-1 / Mater. Sci. Eng. (1972)
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{'key': '2024020415574113700_r16'}
10.1109/EDL.1986.26513 / IEEE Electron Dev. Lett. (1986)
{'key': '2024020415574113700_r18'}
{'key': '2024020415574113700_r19'}
10.1063/1.104431 / Appl. Phys. Lett. (1991)
{'key': '2024020415574113700_r21'}
10.1063/1.89024 / Appl. Phys. Lett. (1976)
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{'key': '2024020415574113700_r24'}

Dates

Type	When
Created	23 years, 1 month ago (July 26, 2002, 9:15 a.m.)
Deposited	1 year, 7 months ago (Feb. 4, 2024, 10:57 a.m.)
Indexed	4 weeks, 2 days ago (Aug. 6, 2025, 8:04 a.m.)
Issued	32 years, 11 months ago (Oct. 1, 1992)
Published	32 years, 11 months ago (Oct. 1, 1992)
Published Print	32 years, 11 months ago (Oct. 1, 1992)

Funders 0

None

BibTeX

@article{Sanchez_1992, title={Slit morphology of electromigration induced open circuit failures in fine line conductors}, volume={72}, ISSN={1089-7550}, url={http://dx.doi.org/10.1063/1.351484}, DOI={10.1063/1.351484}, number={7}, journal={Journal of Applied Physics}, publisher={AIP Publishing}, author={Sanchez, John E. and McKnelly, L. T. and Morris, J. W.}, year={1992}, month=oct, pages={3201–3203} }

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