Abstract
Using aluminum oxide (Al2O3) films deposited by high-rate spatial atomic layer deposition (ALD), we achieve very low surface recombination velocities of 6.5 cm/s on p-type and 8.1 cm/s on n-type crystalline silicon wafers. Using spatially separated reaction zones instead of the conventional time-sequenced precursor dosing enables growth rates up to 70 nm/min, whereas conventional ALD limits the growth rate to <2 nm/min. The excellent passivation level is predominantly assigned to a high negative fixed charge density of Qf=−(4±1)×1012 cm−2 in the Al2O3 films. We demonstrate an excellent thermal stability of the passivation quality.
References
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Dates
Type | When |
---|---|
Created | 14 years, 10 months ago (Oct. 20, 2010, 6:15 p.m.) |
Deposited | 2 years ago (July 31, 2023, 5:11 a.m.) |
Indexed | 2 weeks, 3 days ago (Aug. 6, 2025, 8:23 a.m.) |
Issued | 14 years, 10 months ago (Oct. 18, 2010) |
Published | 14 years, 10 months ago (Oct. 18, 2010) |
Published Online | 14 years, 10 months ago (Oct. 20, 2010) |
Published Print | 14 years, 10 months ago (Oct. 18, 2010) |
@article{Werner_2010, title={Very low surface recombination velocities on p- and n-type c-Si by ultrafast spatial atomic layer deposition of aluminum oxide}, volume={97}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.3505311}, DOI={10.1063/1.3505311}, number={16}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Werner, Florian and Veith, Boris and Tiba, Veronica and Poodt, Paul and Roozeboom, Fred and Brendel, Rolf and Schmidt, Jan}, year={2010}, month=oct }