Crossref journal-article
AIP Publishing
Journal of Applied Physics (317)
Abstract

A new inspection system using laser scattering was developed to characterize bulk microdefects in intrinsic gettering processed Si wafers. The density profiles of bulk microdefects and the width of the denuded zone in Si wafers were measured by this system without any etching treatment. The minimum size observed, as a particle, was estimated at several tens of nm in diameter by comparing a scattering image with a transmission electron microscope observation. From an analysis of the scattering intensity, differences of up to 10% in diameter were recognizable.

Bibliography

Moriya, K., Hirai, K., Kashima, K., & Takasu, S. (1989). Development of a bulk microdefect analyzer for Si wafers. Journal of Applied Physics, 66(11), 5267–5273.

Authors 4
  1. Kazuo Moriya (first)
  2. Katsuyuki Hirai (additional)
  3. Kazuyoshi Kashima (additional)
  4. Shin’ichiro Takasu (additional)
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Dates
Type When
Created 23 years, 1 month ago (July 26, 2002, 9:02 a.m.)
Deposited 1 year, 7 months ago (Feb. 4, 2024, 5:15 a.m.)
Indexed 4 months, 3 weeks ago (April 12, 2025, 1:07 a.m.)
Issued 35 years, 9 months ago (Dec. 1, 1989)
Published 35 years, 9 months ago (Dec. 1, 1989)
Published Print 35 years, 9 months ago (Dec. 1, 1989)
Funders 0

None

@article{Moriya_1989, title={Development of a bulk microdefect analyzer for Si wafers}, volume={66}, ISSN={1089-7550}, url={http://dx.doi.org/10.1063/1.343715}, DOI={10.1063/1.343715}, number={11}, journal={Journal of Applied Physics}, publisher={AIP Publishing}, author={Moriya, Kazuo and Hirai, Katsuyuki and Kashima, Kazuyoshi and Takasu, Shin’ichiro}, year={1989}, month=dec, pages={5267–5273} }