DOI: 10.1063/1.3157196. <i>In situ</i> measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction

In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction

10.1063/1.3157196

Crossref journal-article

AIP Publishing

Journal of Applied Physics (317)

Abstract

Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron x-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the β-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was builtup as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of β-Sn derived from the electromigration data is in good agreement with the calculated value.

Bibliography

Chen, K., Tamura, N., Kunz, M., Tu, K. N., & Lai, Y.-S. (2009). In situ measurement of electromigration-induced transient stress in Pb-free SnâCu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction. Journal of Applied Physics, 106(2).

Authors 5

Kai Chen (first)
N. Tamura (additional)
M. Kunz (additional)
K. N. Tu (additional)
Yi-Shao Lai (additional)

References 30 Referenced 26

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Dates

Type	When
Created	16 years, 1 month ago (July 18, 2009, 4:26 a.m.)
Deposited	2 years, 1 month ago (July 5, 2023, 9:32 p.m.)
Indexed	3 weeks, 2 days ago (July 30, 2025, 6:53 a.m.)
Issued	16 years, 1 month ago (July 15, 2009)
Published	16 years, 1 month ago (July 15, 2009)
Published Online	16 years, 1 month ago (July 16, 2009)
Published Print	16 years, 1 month ago (July 15, 2009)

Funders 0

None

BibTeX

@article{Chen_2009, title={In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction}, volume={106}, ISSN={1089-7550}, url={http://dx.doi.org/10.1063/1.3157196}, DOI={10.1063/1.3157196}, number={2}, journal={Journal of Applied Physics}, publisher={AIP Publishing}, author={Chen, Kai and Tamura, N. and Kunz, M. and Tu, K. N. and Lai, Yi-Shao}, year={2009}, month=jul }

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