DOI: 10.1063/1.2799426. A Method for Precise TEM Sample Preparation Using the FIB Ex-Situ Lift-Out Technique with a Modified Copper Ring in Semiconductor Devices

A Method for Precise TEM Sample Preparation Using the FIB Ex-Situ Lift-Out Technique with a Modified Copper Ring in Semiconductor Devices

10.1063/1.2799426

Crossref proceedings-article

AIP

AIP Conference Proceedings (317)

Bibliography

Lue, J. L., Chang, T. F., Chen, J. C., Wang, T., Seiler, D. G., Diebold, A. C., McDonald, R., Garner, C. M., Herr, D., Khosla, R. P., & Secula, E. M. (2007). A Method for Precise TEM Sample Preparation Using the FIB Ex-Situ Lift-Out Technique with a Modified Copper Ring in Semiconductor Devices. AIP Conference Proceedings, 931, 507â511.

Authors 11

J. L. Lue (first)
T. F. Chang (additional)
J. C. Chen (additional)
T. Wang (additional)
David G. Seiler (additional)
Alain C. Diebold (additional)
Robert McDonald (additional)
C. Michael Garner (additional)
Dan Herr (additional)
Rajinder P. Khosla (additional)
Erik M. Secula (additional)

References 0 Referenced 1

None

Dates

Type	When
Created	17 years, 10 months ago (Sept. 30, 2007, 12:43 p.m.)
Deposited	2 years, 4 months ago (April 20, 2023, 7:31 a.m.)
Indexed	1 year ago (Aug. 5, 2024, 8:26 p.m.)
Issued	18 years, 7 months ago (Jan. 1, 2007)
Published	18 years, 7 months ago (Jan. 1, 2007)
Published Print	18 years, 7 months ago (Jan. 1, 2007)

Funders 0

None

BibTeX

@inproceedings{Lue_2007, title={A Method for Precise TEM Sample Preparation Using the FIB Ex-Situ Lift-Out Technique with a Modified Copper Ring in Semiconductor Devices}, volume={931}, ISSN={0094-243X}, url={http://dx.doi.org/10.1063/1.2799426}, DOI={10.1063/1.2799426}, booktitle={AIP Conference Proceedings}, publisher={AIP}, author={Lue, J. L. and Chang, T. F. and Chen, J. C. and Wang, T. and Seiler, David G. and Diebold, Alain C. and McDonald, Robert and Garner, C. Michael and Herr, Dan and Khosla, Rajinder P. and Secula, Erik M.}, year={2007}, pages={507–511} }

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