DOI: 10.1063/1.2192694. Thermomigration in SnPb composite flip chip solder joints

Thermomigration in SnPb composite flip chip solder joints

10.1063/1.2192694

Crossref journal-article

AIP Publishing

Applied Physics Letters (317)

Abstract

We have used composite flip chip solder joints to study thermomigration. The composite solder joint has 97Pb3Sn on the Si side and eutectic 37Pb63Sn on the substrate side. Redistribution of Sn and Pb occurs in thermomigration, and we found that Sn has moved to the Si side (the hot end) and Pb to the substrate side (the cold end). We estimate the driving force that a temperature gradient of 1000°C∕cm or a temperature difference of 10°C across a solder joint of 100μm in diameter is sufficient to induce the thermomigration.

Bibliography

Huang, A. T., Gusak, A. M., Tu, K. N., & Lai, Y.-S. (2006). Thermomigration in SnPb composite flip chip solder joints. Applied Physics Letters, 88(14).

Authors 4

Annie T. Huang (first)
A. M. Gusak (additional)
K. N. Tu (additional)
Yi-Shao Lai (additional)

References 10 Referenced 145

10.1063/1.1554775 / Appl. Phys. Lett. (2003)
10.1115/1.1898338 / J. Electron. Packag. (2005)
{'year': '2005', 'key': '2023070221504577000_c3', 'first-page': '1421'} (2005)
{'volume-title': 'Diffusion in Solids', 'year': '1989', 'key': '2023070221504577000_c4'} / Diffusion in Solids (1989)
{'volume-title': 'Thermodynamics of Materials', 'year': '1995', 'key': '2023070221504577000_c5'} / Thermodynamics of Materials (1995)
{'key': '2023070221504577000_c6', 'first-page': '606', 'volume': '8', 'year': '1960', 'journal-title': 'Acta Metall.'} / Acta Metall. (1960)
{'year': '1982', 'key': '2023070221504577000_c7', 'first-page': '342'} (1982)
10.1016/0001-6160(76)90080-8 / Acta Metall. (1976)
{'year': '1998', 'key': '2023070221504577000_c9', 'first-page': '337'} (1998)
10.1063/1.1400096 / J. Appl. Phys. (2001)

Dates

Type	When
Created	19 years, 4 months ago (April 3, 2006, 6:04 p.m.)
Deposited	2 years, 1 month ago (July 2, 2023, 5:50 p.m.)
Indexed	1 week, 5 days ago (Aug. 19, 2025, 6:34 a.m.)
Issued	19 years, 4 months ago (April 3, 2006)
Published	19 years, 4 months ago (April 3, 2006)
Published Online	19 years, 4 months ago (April 4, 2006)
Published Print	19 years, 4 months ago (April 3, 2006)

Funders 0

None

BibTeX

@article{Huang_2006, title={Thermomigration in SnPb composite flip chip solder joints}, volume={88}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.2192694}, DOI={10.1063/1.2192694}, number={14}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Huang, Annie T. and Gusak, A. M. and Tu, K. N. and Lai, Yi-Shao}, year={2006}, month=apr }

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