DOI: 10.1063/1.2173569. Reliability Investigations on SnAg Bumps on Substrate Pads with Different Pad Finish

Reliability Investigations on SnAg Bumps on Substrate Pads with Different Pad Finish

10.1063/1.2173569

Crossref proceedings-article

AIP

AIP Conference Proceedings (317)

Bibliography

Bauer, R. (2006). Reliability Investigations on SnAg Bumps on Substrate Pads with Different Pad Finish. AIP Conference Proceedings, 817, 360â366.

Authors 1

R. Bauer (first)

References 0 Referenced 1

None

Dates

Type	When
Created	19 years, 5 months ago (Feb. 24, 2006, 6:04 p.m.)
Deposited	2 years, 4 months ago (April 20, 2023, 6:36 a.m.)
Indexed	1 year ago (Aug. 5, 2024, 8:16 p.m.)
Issued	19 years, 7 months ago (Jan. 1, 2006)
Published	19 years, 7 months ago (Jan. 1, 2006)
Published Print	19 years, 7 months ago (Jan. 1, 2006)

Funders 0

None

BibTeX

@inproceedings{Bauer_2006, title={Reliability Investigations on SnAg Bumps on Substrate Pads with Different Pad Finish}, volume={817}, ISSN={0094-243X}, url={http://dx.doi.org/10.1063/1.2173569}, DOI={10.1063/1.2173569}, booktitle={AIP Conference Proceedings}, publisher={AIP}, author={Bauer, R.}, year={2006}, pages={360–366} }

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