DOI: 10.1063/1.1735869. Spreading Resistance in Cylindrical Semiconductor Devices

Spreading Resistance in Cylindrical Semiconductor Devices

10.1063/1.1735869

Crossref journal-article

AIP Publishing

Journal of Applied Physics (317)

Abstract

For cylindrical semiconductor components, computation of spreading resistance is considered a boundary value problem of the solid circular cylinder. Solutions of this problem may be used, for example, to characterize the thermal spreading resistance within the package of a semiconductor device, the electrical spreading resistance in a mesa type parametric diode, and the extrinsic collector resistance of a mesa transistor. Equations describing the thermal (or electrical) spreading resistance are presented in graphical form for a range of geometrical parameters applicable to many practical situations. Further, examples are given for the potential distribution within each cylindrical structure considered in this analysis.

Bibliography

Kennedy, D. P. (1960). Spreading Resistance in Cylindrical Semiconductor Devices. Journal of Applied Physics, 31(8), 1490â1497.

Authors 1

David P. Kennedy (first)

References 6 Referenced 174

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Dates

Type	When
Created	20 years, 4 months ago (April 25, 2005, 3:12 p.m.)
Deposited	1 year, 6 months ago (Feb. 1, 2024, 2:24 p.m.)
Indexed	3 weeks, 6 days ago (July 30, 2025, 8:24 p.m.)
Issued	65 years ago (Aug. 1, 1960)
Published	65 years ago (Aug. 1, 1960)
Published Print	65 years ago (Aug. 1, 1960)

Funders 0

None

BibTeX

@article{Kennedy_1960, title={Spreading Resistance in Cylindrical Semiconductor Devices}, volume={31}, ISSN={1089-7550}, url={http://dx.doi.org/10.1063/1.1735869}, DOI={10.1063/1.1735869}, number={8}, journal={Journal of Applied Physics}, publisher={AIP Publishing}, author={Kennedy, David P.}, year={1960}, month=aug, pages={1490–1497} }

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