Abstract
Ta–Al2O3 cermet thin films were produced by diode sputtering. Cathodes were fabricated by powder techniques, plasma spraying and as mechanical composites. Film compositions of 1–20 wt% Al2O3 produced resistivities of 250 to 25 000 μΩ·cm and TCR's of +100 to −450 ppm/°C, respectively. The films showed good thermal stability and could be anodized. Electron microscopy and x-ray analyses suggest a film structure consisting of long columnar grains of bcc Ta, approximately 100 Å in diameter, surrounded by Al2O3. A quantitative analysis is made of tunneling currents in an idealized film. Resistivity-composition and resistivity-temperature data are explained in terms of this analysis. The height of the Al2O3 barrier between grains is estimated to be 0.23 eV for an effective electron mass of 1/9. Barrier thicknesses are estimated at 15–30 Å.
References
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Dates
Type | When |
---|---|
Created | 21 years, 6 months ago (Feb. 9, 2004, 11:56 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 1, 2024, 8:43 p.m.) |
Indexed | 1 year, 6 months ago (Feb. 5, 2024, 10:07 a.m.) |
Issued | 55 years, 8 months ago (Dec. 1, 1969) |
Published | 55 years, 8 months ago (Dec. 1, 1969) |
Published Print | 55 years, 8 months ago (Dec. 1, 1969) |
@article{Henrickson_1969, title={Structure and Properties of Sputtered Ta–Al2O3 Cermet Thin Films}, volume={40}, ISSN={1089-7550}, url={http://dx.doi.org/10.1063/1.1657346}, DOI={10.1063/1.1657346}, number={13}, journal={Journal of Applied Physics}, publisher={AIP Publishing}, author={Henrickson, J. F. and Krauss, G. and Tauber, R. N. and Sharp, D. J.}, year={1969}, month=dec, pages={5006–5014} }