Abstract
The highly conductive surface layer induced in diamond by hydrogen termination has been used to fabricate in-plane gate transistors. The conductive channel has been separated from the Ohmic gate contacts by insulating thin lines, obtained by using a combination of electron-beam lithography with surface oxidation. Oxidized lines of about 100 nm show excellent blocking properties, with leakage current of 0.3 pA/μm at 100 V and room temperature. In-plane transistor properties are reported for operation at 77 K and room temperature with good saturation characteristic and complete pinch-off.
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Dates
Type | When |
---|---|
Created | 22 years, 6 months ago (Feb. 10, 2003, 11:22 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 3, 2024, 6:53 p.m.) |
Indexed | 1 year, 2 months ago (May 28, 2024, 8:54 p.m.) |
Issued | 22 years, 6 months ago (Feb. 10, 2003) |
Published | 22 years, 6 months ago (Feb. 10, 2003) |
Published Print | 22 years, 6 months ago (Feb. 10, 2003) |
@article{Garrido_2003, title={Fabrication of in-plane gate transistors on hydrogenated diamond surfaces}, volume={82}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.1545152}, DOI={10.1063/1.1545152}, number={6}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Garrido, J. A. and Nebel, C. E. and Todt, R. and Rösel, G. and Amann, M.-C. and Stutzmann, M. and Snidero, E. and Bergonzo, P.}, year={2003}, month=feb, pages={988–990} }