DOI: 10.1063/1.1446987. Accurate control of the misorientation angles in direct wafer bonding

Accurate control of the misorientation angles in direct wafer bonding

10.1063/1.1446987

Crossref journal-article

AIP Publishing

Applied Physics Letters (317)

Abstract

A direct wafer bonding process has been developed to accurately control both the bonding interface twist and tilt angles between a monocrystalline layer and a bare monocrystalline wafer. This process is based on the bonding of twin surfaces produced by splitting a single wafer, using for instance the Smart Cut® process. A targeted control of ±0.005° is obtained for the twist angle without any crystallographic measurement. Moreover, pure twist-bonded interfaces have been artificially made between two (001) bonded silicon surfaces.

Bibliography

Fournel, F., Moriceau, H., Aspar, B., Rousseau, K., Eymery, J., RouviÃ¨re, J.-L., & Magnea, N. (2002). Accurate control of the misorientation angles in direct wafer bonding. Applied Physics Letters, 80(5), 793â795.

Authors 7

Frank Fournel (first)
Hubert Moriceau (additional)
Bernard Aspar (additional)
Karine Rousseau (additional)
Joël Eymery (additional)
Jean-Luc Rouvière (additional)
Noël Magnea (additional)

References 11 Referenced 57

10.1049/el:19950805 / Electron. Lett. (1995)
10.1007/BF02670888 / J. Electron. Mater. (1991)
10.1016/S0921-4526(98)00206-3 / Physica B (1998)
{'key': '2024020321390349300_r4'}
10.1016/S0921-5107(99)00431-6 / Mater. Sci. Eng., B (2000)
{'key': '2024020321390349300_r6'}
10.1063/1.1362330 / Appl. Phys. Lett. (2001)
10.1063/1.1289656 / Appl. Phys. Lett. (2000)
{'key': '2024020321390349300_r9', 'first-page': '150', 'volume': '1', 'year': '1950', 'journal-title': 'Carnegie Inst. of Tech. and Office of Naval Research'} / Carnegie Inst. of Tech. and Office of Naval Research (1950)
10.1016/S0921-4526(99)01900-6 / Physica B (2000)
10.1080/01418610008212088 / Philos. Mag. A (2000)

Dates

Type	When
Created	23 years, 1 month ago (July 26, 2002, 9:24 a.m.)
Deposited	1 year, 6 months ago (Feb. 3, 2024, 4:39 p.m.)
Indexed	4 months, 4 weeks ago (April 2, 2025, 6:04 a.m.)
Issued	23 years, 6 months ago (Feb. 4, 2002)
Published	23 years, 6 months ago (Feb. 4, 2002)
Published Print	23 years, 6 months ago (Feb. 4, 2002)

Funders 0

None

BibTeX

@article{Fournel_2002, title={Accurate control of the misorientation angles in direct wafer bonding}, volume={80}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.1446987}, DOI={10.1063/1.1446987}, number={5}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Fournel, Frank and Moriceau, Hubert and Aspar, Bernard and Rousseau, Karine and Eymery, Joël and Rouvière, Jean-Luc and Magnea, Noël}, year={2002}, month=feb, pages={793–795} }

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