Abstract
The chemistry and electronic structure of interfaces between Al and copper hexadecafluorophthalocyanine (F16CuPc) are studied via x-ray photoemission spectroscopy, ultraviolet photoemission spectroscopy (UPS), and current–voltage measurements. Electron injection barriers measured by UPS are reported. Analysis of the Al–F16CuPc reaction shows the formation of a phase of three-dimensional (F16CuPc)3Al species. The reacted region is extended at the Al-on-F16CuPc interface and narrow at the F16CuPc-on-Al interface. A series of metal/F16CuPc/metal structures is fabricated to study the impact of the interface chemistry and deposition sequence on device performances. It is found that (F16CuPc)3Al forms a low conductivity region, which has considerable bearing on the electron current. The interface fabrication sequence, which defines the thickness of the reacted region, therefore has a profound impact on device performance.
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Dates
Type | When |
---|---|
Created | 23 years, 1 month ago (July 26, 2002, 8:01 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 6, 2024, 7:17 p.m.) |
Indexed | 1 year, 1 month ago (July 5, 2024, 5:17 p.m.) |
Issued | 23 years, 8 months ago (Dec. 15, 2001) |
Published | 23 years, 8 months ago (Dec. 15, 2001) |
Published Print | 23 years, 8 months ago (Dec. 15, 2001) |
@article{Shen_2001, title={Role of metal–molecule chemistry and interdiffusion on the electrical properties of an organic interface: The Al–F16CuPc case}, volume={90}, ISSN={1089-7550}, url={http://dx.doi.org/10.1063/1.1419263}, DOI={10.1063/1.1419263}, number={12}, journal={Journal of Applied Physics}, publisher={AIP Publishing}, author={Shen, Chongfei and Kahn, Antoine and Schwartz, Jeffrey}, year={2001}, month=dec, pages={6236–6242} }