Abstract
By judiciously placing vacancy and interstitial defects at different depths, we are able to enhance or retard boron diffusion. This opens up a new approach for the formation of shallow P+n junction in silicon. After preimplantation with 50 or 500 keV Si+ ions to produce a surface vacancy-rich region, we studied the diffusion of deposited B on predamaged samples with annealing between 900 and 1010 °C. Boron diffusion retardation was observed in both implantation conditions after low temperature annealing with enhancement occurring in a 50 keV implanted sample at high temperature. Choosing high energy implantation to separate vacancies and interstitials can reduce the boron diffusion significantly. Such suppression became more obvious with higher implant doses. A junction less than 10 nm deep (at 1×1017 cm−3 according to carrier concentration profiles) can be formed.
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Dates
Type | When |
---|---|
Created | 23 years, 1 month ago (July 26, 2002, 10:16 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 3, 2024, 2:57 p.m.) |
Indexed | 4 days, 23 hours ago (Aug. 23, 2025, 9:24 p.m.) |
Issued | 24 years, 4 months ago (April 16, 2001) |
Published | 24 years, 4 months ago (April 16, 2001) |
Published Print | 24 years, 4 months ago (April 16, 2001) |
@article{Shao_2001, title={Retardation of boron diffusion in silicon by defect engineering}, volume={78}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.1361280}, DOI={10.1063/1.1361280}, number={16}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Shao, Lin and Lu, Xinming and Wang, Xuemei and Rusakova, Irene and Liu, Jiarui and Chu, Wei-Kan}, year={2001}, month=apr, pages={2321–2323} }