Abstract
The rutile stoichiometric phase of RuO2, deposited via reactive sputtering, was evaluated as a gate electrode on chemical vapor deposited ZrO2 and Zr silicate for Si–p-type metal–oxide–semiconductor (PMOS) devices. Thermal and chemical stability of the electrodes was studied at annealing temperatures of 400, 600, and 800 °C in N2. X-ray diffraction was measured to study grain structure and interface reactions. The resistivity of RuO2 films was 65.0 μΩ cm after 800 °C annealing. Electrical properties were evaluated on MOS capacitors, which indicated that the work function of RuO2 was ∼5.1 eV, compatible with PMOS devices. Post-RuO2 gate annealing up to 800 °C, resulted in only a 1.4 Å equivalent oxide thickness (Tox-eq) change and 0.2 V flatband voltage change for Zr silicate and a 4 Å Tox-eq change for ZrO2 dielectrics. Tantalum electrodes were also studied on ZrO2 as a comparison of the stability of RuO2 electrodes.
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Dates
Type | When |
---|---|
Created | 23 years, 1 month ago (July 26, 2002, 9:24 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 3, 2024, 2:39 p.m.) |
Indexed | 4 months, 2 weeks ago (April 15, 2025, 2:10 a.m.) |
Issued | 24 years, 6 months ago (Feb. 19, 2001) |
Published | 24 years, 6 months ago (Feb. 19, 2001) |
Published Print | 24 years, 6 months ago (Feb. 19, 2001) |
@article{Zhong_2001, title={Characterization of RuO2 electrodes on Zr silicate and ZrO2 dielectrics}, volume={78}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.1347402}, DOI={10.1063/1.1347402}, number={8}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Zhong, Huicai and Heuss, Greg and Misra, Veena and Luan, Hongfa and Lee, Choong-Ho and Kwong, Dim-Lee}, year={2001}, month=feb, pages={1134–1136} }