Crossref journal-article
AIP Publishing
Applied Physics Letters (317)
Abstract

High dielectric constant Hf–Sn–Ti–O thin-film materials were identified using a compositional-spread approach. Thin films of composition Hf0.2Sn0.05Ti0.75O2 prepared at 250 °C have excellent dielectric properties: 40–70-nm-thick films with a dielectric constant of 40–60 were obtained, depending on the processing conditions, yielding a specific capacitance of 9–17 fF/μm2. Breakdown fields were measured to be about 3–4 MV/cm, yielding a figure of merit εε0Ebr∼19 μC/cm2. Leakage currents, measured at 1 MV/cm, were in the range 10−7−10−6 A/cm2.

Bibliography

Schneemeyer, L. F., van Dover, R. B., & Fleming, R. M. (1999). High dielectric constant Hf–Sn–Ti–O thin films. Applied Physics Letters, 75(13), 1967–1969.

Authors 3
  1. L. F. Schneemeyer (first)
  2. R. B. van Dover (additional)
  3. R. M. Fleming (additional)
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Dates
Type When
Created 23 years ago (July 26, 2002, 9:29 a.m.)
Deposited 1 year, 6 months ago (Feb. 3, 2024, 11:53 a.m.)
Indexed 4 months, 1 week ago (April 17, 2025, 2:29 a.m.)
Issued 25 years, 10 months ago (Sept. 27, 1999)
Published 25 years, 10 months ago (Sept. 27, 1999)
Published Print 25 years, 10 months ago (Sept. 27, 1999)
Funders 0

None

@article{Schneemeyer_1999, title={High dielectric constant Hf–Sn–Ti–O thin films}, volume={75}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.124887}, DOI={10.1063/1.124887}, number={13}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Schneemeyer, L. F. and van Dover, R. B. and Fleming, R. M.}, year={1999}, month=sep, pages={1967–1969} }