Abstract
High dielectric constant Hf–Sn–Ti–O thin-film materials were identified using a compositional-spread approach. Thin films of composition Hf0.2Sn0.05Ti0.75O2 prepared at 250 °C have excellent dielectric properties: 40–70-nm-thick films with a dielectric constant of 40–60 were obtained, depending on the processing conditions, yielding a specific capacitance of 9–17 fF/μm2. Breakdown fields were measured to be about 3–4 MV/cm, yielding a figure of merit εε0Ebr∼19 μC/cm2. Leakage currents, measured at 1 MV/cm, were in the range 10−7−10−6 A/cm2.
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Dates
Type | When |
---|---|
Created | 23 years ago (July 26, 2002, 9:29 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 3, 2024, 11:53 a.m.) |
Indexed | 4 months, 1 week ago (April 17, 2025, 2:29 a.m.) |
Issued | 25 years, 10 months ago (Sept. 27, 1999) |
Published | 25 years, 10 months ago (Sept. 27, 1999) |
Published Print | 25 years, 10 months ago (Sept. 27, 1999) |
@article{Schneemeyer_1999, title={High dielectric constant Hf–Sn–Ti–O thin films}, volume={75}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.124887}, DOI={10.1063/1.124887}, number={13}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Schneemeyer, L. F. and van Dover, R. B. and Fleming, R. M.}, year={1999}, month=sep, pages={1967–1969} }