Abstract
We have investigated the diffusion enhancement mechanism of boron-enhanced diffusion (BED), wherein boron diffusivity is enhanced four to five times over the equilibrium diffusivity at 1050 °C in the proximity of a silicon layer containing a high boron concentration. It is demonstrated that BED is driven by excess interstitials injected from the high boron concentration layer during annealing. For evaporated layers, BED is observed above a threshold boron concentration between 1% and 10%, though it appears to be closer to 1% for B-implanted layers. For sub-keV B implants above the threshold, BED dominates over the contribution from transient-enhanced diffusion to junction depth. For 0.5 keV B, this threshold implantation dose lies between 3×1014 and 1×1015 cm−2. It is proposed that the excess interstitials responsible for BED are produced during the formation of a silicon boride phase in the high B concentration layers.
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Dates
Type | When |
---|---|
Created | 23 years, 1 month ago (July 26, 2002, 9:31 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 3, 2024, 11:02 a.m.) |
Indexed | 2 months ago (June 25, 2025, 1:49 a.m.) |
Issued | 26 years, 4 months ago (April 26, 1999) |
Published | 26 years, 4 months ago (April 26, 1999) |
Published Print | 26 years, 4 months ago (April 26, 1999) |
@article{Agarwal_1999, title={Boron-enhanced diffusion of boron from ultralow-energy ion implantation}, volume={74}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.123872}, DOI={10.1063/1.123872}, number={17}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Agarwal, Aditya and Gossmann, H.-J. and Eaglesham, D. J. and Herner, S. B. and Fiory, A. T. and Haynes, T. E.}, year={1999}, month=apr, pages={2435–2437} }