Abstract
The thermal deposition of Co onto Cu(111) results in three-dimensional island growth and a face-centered-cubic-hexagonal-close-packed stacking fault, which hinders a complete antiferromagnetic coupling in Co/Cu(111) superlattices. We report that Co/Cu(111) films can be grown with good layer-by-layer morphology and significantly less stacking faults by pulsed laser deposition. We show that a complete antiferromagnetic coupling can be achieved in the pulsed laser deposited Co/Cu trilayer.
References
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Dates
Type | When |
---|---|
Created | 23 years ago (July 26, 2002, 9:31 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 3, 2024, 10:34 a.m.) |
Indexed | 1 year, 6 months ago (Feb. 10, 2024, 11:06 a.m.) |
Issued | 26 years, 7 months ago (Jan. 18, 1999) |
Published | 26 years, 7 months ago (Jan. 18, 1999) |
Published Print | 26 years, 7 months ago (Jan. 18, 1999) |
@article{Zheng_1999, title={Suppression of the face-centered-cubic-hexagonal-close-packed stacking fault in Co/Cu(111) ultrathin films by pulsed laser deposition}, volume={74}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.123049}, DOI={10.1063/1.123049}, number={3}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Zheng, M. and Shen, J. and Mohan, Ch. V. and Ohresser, P. and Barthel, J. and Kirschner, J.}, year={1999}, month=jan, pages={425–427} }