Abstract
Using high resolution transmission electron microscopy, a thin pseudomorphic AlN layer (2–3 nm) has been observed at the metal/GaN interfaces of Ti/Al (35/115 nm) and Pd/Al (25/125 nm) ohmic contacts to n-type GaN annealed in Ar at 600 °C for 15 and 30 s, respectively. The interfacial layer has a c-plane (002) lattice spacing of 2.48±.03 Å and an a-plane (100) spacing matching that of GaN (2.76 Å), and the identification of this layer as AlN is consistent with chemical analysis by energy dispersive x-ray spectroscopy. The formation of this interfacial AlN layer coincides with the onset of ohmic behavior in Ti/Al and Pd/Al contacts annealed at 600 °C and may be the cause.
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Dates
Type | When |
---|---|
Created | 23 years, 1 month ago (July 26, 2002, 9:31 a.m.) |
Deposited | 1 year, 7 months ago (Feb. 3, 2024, 8:46 a.m.) |
Indexed | 2 months, 1 week ago (June 26, 2025, 1:45 p.m.) |
Issued | 27 years, 8 months ago (Dec. 29, 1997) |
Published | 27 years, 8 months ago (Dec. 29, 1997) |
Published Print | 27 years, 8 months ago (Dec. 29, 1997) |
@article{Luther_1997, title={Analysis of a thin AlN interfacial layer in Ti/Al and Pd/Al ohmic contacts to n-type GaN}, volume={71}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.120526}, DOI={10.1063/1.120526}, number={26}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Luther, B. P. and DeLucca, J. M. and Mohney, S. E. and Karlicek, R. F.}, year={1997}, month=dec, pages={3859–3861} }