Abstract
Ultrathin (8–23 Å) silicon oxynitrides have been studied in the temperature range of 560–1000 °C in 4 Torr of NO using a sequential growth and analysis approach. X-ray photoelectron spectroscopy indicates that with increasing growth temperature and time, a bonding structure with predominantly Si–O rather than Si–N formation is favored. Simultaneously, the average volume fraction of N (N/N+O) in the dielectric decreases, as a consequence of which the N1s binding energy increases by 0.2–0.8 eV from its initial value of 397.8 eV at a thickness of 8 Å. A correlation of the electrical characteristics of NO grown oxynitrides with nitrogen content and location has been made. A film growth mechanism that takes into account the removal of previously incorporated N by NO is also proposed.
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Dates
Type | When |
---|---|
Created | 23 years ago (July 26, 2002, 9:29 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 3, 2024, 7:05 a.m.) |
Indexed | 1 year, 6 months ago (Feb. 11, 2024, 12:21 a.m.) |
Issued | 28 years, 7 months ago (Jan. 6, 1997) |
Published | 28 years, 7 months ago (Jan. 6, 1997) |
Published Print | 28 years, 7 months ago (Jan. 6, 1997) |
@article{Kamath_1997, title={Oxidation of Si(100) in nitric oxide at low pressures: An x-ray photoelectron spectroscopy study}, volume={70}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.119307}, DOI={10.1063/1.119307}, number={1}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Kamath, A. and Kwong, D. L. and Sun, Y. M. and Blass, P. M. and Whaley, S. and White, J. M.}, year={1997}, month=jan, pages={63–65} }