Abstract
We have developed a method for removing oxides and producing atomically flat Si(100) surfaces with single atomic height steps using a Si flux cleaning technique. By introducing a Si flux in the range 1.0–1.5 Å/s at the onset of an SiO2 thermal desorption step as low as 780 °C, scanning tunneling microscopy (STM) and atomic force microscopy images reveal smooth surfaces with atomically flat terraces with an rms roughness of 0.5 Å and single-step heights of 1.4 Å. STM reveals that A- and B-type steps are present across the entire area of the scanned surface. Desorption of the surface oxide layer with Si fluxes below this range results in rougher surfaces with pits ∼50 Å deep and 1000 Å across. For Si fluxes above this range, no pits are seen but atomic steps are not visible on the surface.
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Dates
Type | When |
---|---|
Created | 23 years, 1 month ago (July 26, 2002, 9:36 a.m.) |
Deposited | 1 year, 7 months ago (Feb. 3, 2024, 7:33 a.m.) |
Indexed | 3 months ago (June 4, 2025, 4:27 p.m.) |
Issued | 28 years, 4 months ago (April 28, 1997) |
Published | 28 years, 4 months ago (April 28, 1997) |
Published Print | 28 years, 4 months ago (April 28, 1997) |
@article{Wilk_1997, title={In situ Si flux cleaning technique for producing atomically flat Si(100) surfaces at low temperature}, volume={70}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.119083}, DOI={10.1063/1.119083}, number={17}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Wilk, G. D. and Wei, Yi and Edwards, Hal and Wallace, R. M.}, year={1997}, month=apr, pages={2288–2290} }