DOI: 10.1063/1.107980. Electromigration induced transgranular slit failures in near bamboo Al and Al-2% Cu thin-film interconnects

Electromigration induced transgranular slit failures in near bamboo Al and Al-2% Cu thin-film interconnects

10.1063/1.107980

Crossref journal-article

AIP Publishing

Applied Physics Letters (317)

Abstract

We report the morphology of electromigration induced transgranular slit-like voids in Al and Al-2% Cu thin-film interconnects with near bamboo microstructures. The grain structure surrounding fatal voids was determined from images produced by scanning electron and focused ion beam microscopy. Fatal voids were seen to traverse grains near to, but apart from, bamboo boundaries or grain triple points, and often appear to emanate from small wedge-shaped voids at the interconnect edge. The small volume slit voids are consistent with an observed decrease in fatal void volume with reduced linewidth/grain size ratio. However, the transgranular void pathway represents a new failure mechanism responsible for reduced reliability in the narrow interconnects which are more relevant for advanced integrated circuit technologies. The conditions for stress-induced transgranular slit voiding are briefly discussed.

Bibliography

Sanchez, J. E., Kraft, O., & Arzt, E. (1992). Electromigration induced transgranular slit failures in near bamboo Al and Al-2% Cu thin-film interconnects. Applied Physics Letters, 61(26), 3121â3123.

Authors 3

John E. Sanchez (first)
Oliver Kraft (additional)
Eduard Arzt (additional)

References 13 Referenced 61

10.1063/1.91508 / Appl. Phys. Lett. (1980)
10.1007/BF02673335 / J. Electron. Mater. (1990)
10.1063/1.351484 / J. Appl. Phys. (1992)
{'key': '2024020304580857900_r4'}
10.1109/EDL.1986.26513 / IEEE Electron Dev. Lett. (1986)
{'key': '2024020304580857900_r6', 'first-page': '1240', 'volume': 'NS-30', 'year': '1983', 'journal-title': 'IEEE Trans. Nucl. Sci.'} / IEEE Trans. Nucl. Sci. (1983)
{'key': '2024020304580857900_r7', 'first-page': '74', 'volume': '11', 'year': '1984', 'journal-title': 'Scanning Electron Microsc.'} / Scanning Electron Microsc. (1984)
{'key': '2024020304580857900_r8'}
10.1063/1.42680 / AIP Conf. Proc. (1992)
10.1063/1.108284 / Appl. Phys. Lett. (1992)
{'key': '2024020304580857900_r11', 'first-page': '134', 'volume': '29', 'year': '1992', 'journal-title': 'Adv. Appl. Mechan.'} / Adv. Appl. Mechan. (1992)
{'key': '2024020304580857900_r12'}
10.1007/BF02673337 / J. Electron. Mater. (1990)

Dates

Type	When
Created	23 years, 1 month ago (July 26, 2002, 9:36 a.m.)
Deposited	1 year, 6 months ago (Feb. 2, 2024, 11:58 p.m.)
Indexed	3 weeks, 5 days ago (Aug. 6, 2025, 9:06 a.m.)
Issued	32 years, 8 months ago (Dec. 28, 1992)
Published	32 years, 8 months ago (Dec. 28, 1992)
Published Print	32 years, 8 months ago (Dec. 28, 1992)

Funders 0

None

BibTeX

@article{Sanchez_1992, title={Electromigration induced transgranular slit failures in near bamboo Al and Al-2% Cu thin-film interconnects}, volume={61}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.107980}, DOI={10.1063/1.107980}, number={26}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Sanchez, John E. and Kraft, Oliver and Arzt, Eduard}, year={1992}, month=dec, pages={3121–3123} }

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