Abstract
The low pressure chemical vapor deposition (CVD) process of SiO2 from SiH4 and O2 has been analyzed. For deposition at pressures ranging from 10−3 to 3 Torr, with no carrier gas, the process is dominated by fast gas-phase reactions. In situ analytical techniques, such as mass spectrometry and high-resolution electron energy loss spectroscopy, indicate that hydroxyl groups are reaction products and are imbedded into the growing oxide at temperatures from 300 to 600 °C. Presence of these groups is detrimental to the electrical properties of metal-oxide-semiconductor (MOS) structures, e.g., by causing low-field breakdown and by increasing the interface state density. Low-pressure (SiH4/O2) oxides are thus principally not well suited for gate-oxide applications because of their underlying chemistry.
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Dates
Type | When |
---|---|
Created | 23 years, 1 month ago (July 26, 2002, 9:33 a.m.) |
Deposited | 1 year, 7 months ago (Feb. 2, 2024, 10:29 p.m.) |
Indexed | 2 months, 2 weeks ago (June 16, 2025, 8:07 a.m.) |
Issued | 33 years, 7 months ago (Jan. 13, 1992) |
Published | 33 years, 7 months ago (Jan. 13, 1992) |
Published Print | 33 years, 7 months ago (Jan. 13, 1992) |
@article{Liehr_1992, title={Low pressure chemical vapor deposition of oxide from SiH4/O2: Chemistry and effects on electrical properties}, volume={60}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.106962}, DOI={10.1063/1.106962}, number={2}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Liehr, M. and Cohen, S. A.}, year={1992}, month=jan, pages={198–200} }