Abstract
In this paper a physical model is presented for boron penetration through an oxynitride gate dielectric prepared by rapid thermal processing in a nitrous oxide (N2O) ambient. Compared with a conventional rapid thermally grown oxide, oxynitride dielectrics show excellent diffusion barrier properties to the dopant (BF2). The Auger electron spectroscopy nitrogen depth profile shows nitrogen pileup at the Si/SiO2 interface, which may explain the lower segregation coefficient (≊20 times lower) of the oxynitride dielectric, as expected from suprem-iii simulation with modified diffusivity values.
References
6
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Dates
Type | When |
---|---|
Created | 23 years, 1 month ago (July 26, 2002, 9:31 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 2, 2024, 9:56 p.m.) |
Indexed | 1 year, 6 months ago (Feb. 11, 2024, 9:21 a.m.) |
Issued | 33 years, 11 months ago (Sept. 23, 1991) |
Published | 33 years, 11 months ago (Sept. 23, 1991) |
Published Print | 33 years, 11 months ago (Sept. 23, 1991) |
@article{Hwang_1991, title={A physical model for boron penetration through an oxynitride gate dielectric prepared by rapid thermal processing in N2O}, volume={59}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.106290}, DOI={10.1063/1.106290}, number={13}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Hwang, Hyunsang and Ting, Wenchi and Kwong, Dim-Lee and Lee, Jack}, year={1991}, month=sep, pages={1581–1582} }