Abstract
This letter presents a unique process to grow high quality ultrathin (∼60 Å) gate dielectrics using N2O (nitrous oxide) gas. Compared with conventional rapid thermally grown oxide in the O2, the new oxynitride dielectrics show very large charge-to-breakdown (at +50 mA/cm2, 850 C/cm2 for oxynitride compared to 95 C/cm2 for the control thermal oxide) and less charge trapping under constant current stress. Significantly reduced interface state generation was also observed under constant current stress and x-ray radiation. A secondary-ion mass spectroscopy depth profile indicates a nitrogen-rich layer at the Si/SiO2 interface, which can explain the improved integrity of oxynitride dielectric.
References
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Dates
Type | When |
---|---|
Created | 23 years ago (July 26, 2002, 8:51 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 2, 2024, 8:25 p.m.) |
Indexed | 4 months ago (April 20, 2025, 12:29 a.m.) |
Issued | 34 years, 11 months ago (Sept. 3, 1990) |
Published | 34 years, 11 months ago (Sept. 3, 1990) |
Published Print | 34 years, 11 months ago (Sept. 3, 1990) |
@article{Hwang_1990, title={Electrical characteristics of ultrathin oxynitride gate dielectric prepared by rapid thermal oxidation of Si in N2O}, volume={57}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.103550}, DOI={10.1063/1.103550}, number={10}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Hwang, Hyunsang and Ting, Wenchi and Maiti, Bikas and Kwong, Dim-Lee and Lee, Jack}, year={1990}, month=sep, pages={1010–1011} }