Abstract
The effects of implantation damage on B diffusion are analyzed through the use of 29Si implants. Implant doses of 29Si ranging from 1×1012/cm2 to 1×1014/cm2 were used to create controlled amounts of damage. Temperatures ranging from 800 to 1000 °C were used to anneal the implant damage. For all anneal temperatures, the peak B concentration was well below the intrinsic electron concentration. Even for 29Si doses as low as 1×1012/cm2 significantly enhanced B diffusion was observed. The largest enhancement in B diffusion was observed for the highest 29Si implant dose and lowest anneal temperature. The kinetics of damage annealing determine the transient enhancement in the B profile. These results have important implications for the formation of shallow junctions using ion implantation.
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Dates
Type | When |
---|---|
Created | 23 years, 1 month ago (July 26, 2002, 8:51 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 2, 2024, 7:55 p.m.) |
Indexed | 4 months, 2 weeks ago (April 19, 2025, 1:07 a.m.) |
Issued | 35 years, 4 months ago (April 30, 1990) |
Published | 35 years, 4 months ago (April 30, 1990) |
Published Print | 35 years, 4 months ago (April 30, 1990) |
@article{Packan_1990, title={Transient diffusion of low-concentration B in Si due to 29Si implantation damage}, volume={56}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.103100}, DOI={10.1063/1.103100}, number={18}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Packan, P. A. and Plummer, J. D.}, year={1990}, month=apr, pages={1787–1789} }