Abstract
Etching enhancement in through-implanted SiO2 has been characterized by nuclear-deposited energy independently of implant conditions. An empirical expression has been proposed to describe the etching rate for any implantation. The enhanced etching has been related to the Si-O vibrational frequency shift. Etching enhancement has been found to reflect the structural change in SiO2, and to be a good measure of degradation. The structural change of SiO2 stops and the etching rate reaches a maximum for an ion dose corresponding to nuclear-deposited energy larger than 3.4×1023 eV/cm3. This energy is equal to the total SiO bonding energy (3.8 eV) in a unit volume of SiO2.
References
12
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Dates
Type | When |
---|---|
Created | 23 years, 1 month ago (July 26, 2002, 9:05 a.m.) |
Deposited | 1 year, 6 months ago (Feb. 2, 2024, 6:32 p.m.) |
Indexed | 1 year, 6 months ago (Feb. 4, 2024, 9:45 a.m.) |
Issued | 36 years, 5 months ago (March 20, 1989) |
Published | 36 years, 5 months ago (March 20, 1989) |
Published Print | 36 years, 5 months ago (March 20, 1989) |
@article{Hiraiwa_1989, title={Novel characterization of implant damage in SiO2 by nuclear-deposited energy}, volume={54}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.101429}, DOI={10.1063/1.101429}, number={12}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Hiraiwa, A. and Usui, H. and Yagi, K.}, year={1989}, month=mar, pages={1106–1108} }