DOI: 10.1063/1.101054. Grain size dependence of electromigration-induced failures in narrow interconnects

Grain size dependence of electromigration-induced failures in narrow interconnects

10.1063/1.101054

Crossref journal-article

AIP Publishing

Applied Physics Letters (317)

Abstract

Measurements of the median time to failure (MTTF) and deviation in the time to electromigration-induced failure (DTTF) of Al alloy thin-film lines are reported. As the ratio of the linewidth to the grain size decreases, MTTF decreases to a minimum and then increases exponentially. DTTF continuously increases. We show that serial and parallel failure unit models can be used to explain the grain size and linewidth dependence of the MTTF and DTTF for interconnects. We further note that extrapolation to low cumulative failures based on serial failure models must be based on knowledge of the failure statistics of individual units.

Bibliography

Cho, J., & Thompson, C. V. (1989). Grain size dependence of electromigration-induced failures in narrow interconnects. Applied Physics Letters, 54(25), 2577â2579.

Authors 2

J. Cho (first)
C. V. Thompson (additional)

References 10 Referenced 193

{'key': '2024020223463688900_r1'}
10.1063/1.1659233 / J. Appl. Phys. (1970)
10.1063/1.1658395 / J. Appl. Phys. (1970)
10.1063/1.91508 / Appl. Phys. Lett. (1980)
10.1063/1.91385 / Appl. Phys. Lett. (1980)
10.1016/0040-6090(72)90103-4 / Thin Solid Films (1972)
{'key': '2024020223463688900_r7'}
{'key': '2024020223463688900_r8', 'first-page': '667', 'volume': 'EDL-7', 'year': '1986', 'journal-title': 'IEEE Electron Device Lett.'} / IEEE Electron Device Lett. (1986)
10.1063/1.1659778 / J. Appl. Phys. (1971)
10.1063/1.99958 / Appl. Phys. Lett. (1988)

Dates

Type	When
Created	23 years ago (July 26, 2002, 8:51 a.m.)
Deposited	1 year, 6 months ago (Feb. 2, 2024, 6:46 p.m.)
Indexed	5 days, 6 hours ago (Aug. 19, 2025, 7:02 a.m.)
Issued	36 years, 2 months ago (June 19, 1989)
Published	36 years, 2 months ago (June 19, 1989)
Published Print	36 years, 2 months ago (June 19, 1989)

Funders 0

None

BibTeX

@article{Cho_1989, title={Grain size dependence of electromigration-induced failures in narrow interconnects}, volume={54}, ISSN={1077-3118}, url={http://dx.doi.org/10.1063/1.101054}, DOI={10.1063/1.101054}, number={25}, journal={Applied Physics Letters}, publisher={AIP Publishing}, author={Cho, J. and Thompson, C. V.}, year={1989}, month=jun, pages={2577–2579} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2025,
        8,
        19
      ]
    ],
    "date-time": "2025-08-19T11:02:22Z",
    "timestamp": 1755601342396
  },
  "reference-count": 10,
  "publisher": "AIP Publishing",
  "issue": "25",
  "content-domain": {
    "domain": [
      "pubs.aip.org"
    ],
    "crossmark-restriction": true
  },
  "published-print": {
    "date-parts": [
      [
        1989,
        6,
        19
      ]
    ]
  },
  "abstract": "<jats:p>Measurements of the median time to failure (MTTF) and deviation in the time to electromigration-induced failure (DTTF) of Al alloy thin-film lines are reported. As the ratio of the linewidth to the grain size decreases, MTTF decreases to a minimum and then increases exponentially. DTTF continuously increases. We show that serial and parallel failure unit models can be used to explain the grain size and linewidth dependence of the MTTF and DTTF for interconnects. We further note that extrapolation to low cumulative failures based on serial failure models must be based on knowledge of the failure statistics of individual units.</jats:p>",
  "DOI": "10.1063/1.101054",
  "type": "journal-article",
  "created": {
    "date-parts": [
      [
        2002,
        7,
        26
      ]
    ],
    "date-time": "2002-07-26T12:51:02Z",
    "timestamp": 1027687862000
  },
  "page": "2577-2579",
  "update-policy": "http://dx.doi.org/10.1063/aip-crossmark-policy-page",
  "source": "Crossref",
  "is-referenced-by-count": 193,
  "title": "Grain size dependence of electromigration-induced failures in narrow interconnects",
  "prefix": "10.1063",
  "volume": "54",
  "author": [
    {
      "given": "J.",
      "family": "Cho",
      "sequence": "first",
      "affiliation": [
        {
          "name": "Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139"
        }
      ]
    },
    {
      "given": "C. V.",
      "family": "Thompson",
      "sequence": "additional",
      "affiliation": [
        {
          "name": "Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139"
        }
      ]
    }
  ],
  "member": "317",
  "reference": [
    {
      "key": "2024020223463688900_r1"
    },
    {
      "key": "2024020223463688900_r2",
      "doi-asserted-by": "crossref",
      "first-page": "2381",
      "DOI": "10.1063/1.1659233",
      "volume": "41",
      "year": "1970",
      "journal-title": "J. Appl. Phys."
    },
    {
      "key": "2024020223463688900_r3",
      "doi-asserted-by": "crossref",
      "first-page": "3954",
      "DOI": "10.1063/1.1658395",
      "volume": "41",
      "year": "1970",
      "journal-title": "J. Appl. Phys."
    },
    {
      "key": "2024020223463688900_r4",
      "doi-asserted-by": "crossref",
      "first-page": "464",
      "DOI": "10.1063/1.91508",
      "volume": "36",
      "year": "1980",
      "journal-title": "Appl. Phys. Lett."
    },
    {
      "key": "2024020223463688900_r5",
      "doi-asserted-by": "crossref",
      "first-page": "968",
      "DOI": "10.1063/1.91385",
      "volume": "36",
      "year": "1980",
      "journal-title": "Appl. Phys. Lett."
    },
    {
      "key": "2024020223463688900_r6",
      "doi-asserted-by": "crossref",
      "first-page": "399",
      "DOI": "10.1016/0040-6090(72)90103-4",
      "volume": "12",
      "year": "1972",
      "journal-title": "Thin Solid Films"
    },
    {
      "key": "2024020223463688900_r7"
    },
    {
      "key": "2024020223463688900_r8",
      "first-page": "667",
      "volume": "EDL-7",
      "year": "1986",
      "journal-title": "IEEE Electron Device Lett."
    },
    {
      "key": "2024020223463688900_r9",
      "doi-asserted-by": "crossref",
      "first-page": "4343",
      "DOI": "10.1063/1.1659778",
      "volume": "42",
      "year": "1971",
      "journal-title": "J. Appl. Phys."
    },
    {
      "key": "2024020223463688900_r10",
      "doi-asserted-by": "crossref",
      "first-page": "1414",
      "DOI": "10.1063/1.99958",
      "volume": "53",
      "year": "1988",
      "journal-title": "Appl. Phys. Lett."
    }
  ],
  "container-title": "Applied Physics Letters",
  "original-title": [],
  "language": "en",
  "link": [
    {
      "URL": "https://pubs.aip.org/aip/apl/article-pdf/54/25/2577/18471549/2577_1_online.pdf",
      "content-type": "application/pdf",
      "content-version": "vor",
      "intended-application": "syndication"
    },
    {
      "URL": "https://pubs.aip.org/aip/apl/article-pdf/54/25/2577/18471549/2577_1_online.pdf",
      "content-type": "unspecified",
      "content-version": "vor",
      "intended-application": "similarity-checking"
    }
  ],
  "deposited": {
    "date-parts": [
      [
        2024,
        2,
        2
      ]
    ],
    "date-time": "2024-02-02T23:46:45Z",
    "timestamp": 1706917605000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "https://pubs.aip.org/apl/article/54/25/2577/55540/Grain-size-dependence-of-electromigration-induced"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        1989,
        6,
        19
      ]
    ]
  },
  "references-count": 10,
  "journal-issue": {
    "issue": "25",
    "published-print": {
      "date-parts": [
        [
          1989,
          6,
          19
        ]
      ]
    }
  },
  "URL": "http://dx.doi.org/10.1063/1.101054",
  "relation": {},
  "ISSN": [
    "0003-6951",
    "1077-3118"
  ],
  "subject": [],
  "published-other": {
    "date-parts": [
      [
        1989,
        6,
        19
      ]
    ]
  },
  "published": {
    "date-parts": [
      [
        1989,
        6,
        19
      ]
    ]
  }
}