3D integrated superconducting qubits
10.1038/s41534-017-0044-0
Crossref journal-article
Springer Science and Business Media LLC
npj Quantum Information (297)
Abstract

AbstractAs the field of quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control. We demonstrate that high qubit coherence (T1, T2,echo > 20 μs) is maintained in a flip-chip geometry in the presence of galvanic, capacitive, and inductive coupling between the chips.

Bibliography

Rosenberg, D., Kim, D., Das, R., Yost, D., Gustavsson, S., Hover, D., Krantz, P., Melville, A., Racz, L., Samach, G. O., Weber, S. J., Yan, F., Yoder, J. L., Kerman, A. J., & Oliver, W. D. (2017). 3D integrated superconducting qubits. Npj Quantum Information, 3(1).

Authors 15
  1. D. Rosenberg (first)
  2. D. Kim (additional)
  3. R. Das (additional)
  4. D. Yost (additional)
  5. S. Gustavsson (additional)
  6. D. Hover (additional)
  7. P. Krantz (additional)
  8. A. Melville (additional)
  9. L. Racz (additional)
  10. G. O. Samach (additional)
  11. S. J. Weber (additional)
  12. F. Yan (additional)
  13. J. L. Yoder (additional)
  14. A. J. Kerman (additional)
  15. W. D. Oliver (additional)
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Dates
Type When
Created 7 years, 10 months ago (Oct. 4, 2017, 2:39 a.m.)
Deposited 2 years, 8 months ago (Dec. 22, 2022, 8:46 p.m.)
Indexed 4 days, 3 hours ago (Aug. 19, 2025, 6:48 a.m.)
Issued 7 years, 10 months ago (Oct. 9, 2017)
Published 7 years, 10 months ago (Oct. 9, 2017)
Published Online 7 years, 10 months ago (Oct. 9, 2017)
Funders 0

None

@article{Rosenberg_2017, title={3D integrated superconducting qubits}, volume={3}, ISSN={2056-6387}, url={http://dx.doi.org/10.1038/s41534-017-0044-0}, DOI={10.1038/s41534-017-0044-0}, number={1}, journal={npj Quantum Information}, publisher={Springer Science and Business Media LLC}, author={Rosenberg, D. and Kim, D. and Das, R. and Yost, D. and Gustavsson, S. and Hover, D. and Krantz, P. and Melville, A. and Racz, L. and Samach, G. O. and Weber, S. J. and Yan, F. and Yoder, J. L. and Kerman, A. J. and Oliver, W. D.}, year={2017}, month=oct }