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Journal of Materials Science (297)
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McGUIRE, K., DANYLUK, S., BAKER, T. L., RUPNOW, J. W., & McLAUGHLIN, D. (1997). The influence of backgrinding on the fracture strength of 100 mm diameter (1 1 1) p-type silicon wafers. Journal of Materials Science, 32(4), 1017–1024.

Authors 5
  1. K McGUIRE (first)
  2. S DANYLUK (additional)
  3. T. L BAKER (additional)
  4. J. W RUPNOW (additional)
  5. D McLAUGHLIN (additional)
References 12 Referenced 17
  1. W. P. RUNYAN, “Silicon SemiconductorTechnology”, (McGraw Hill, New York, 1985) p. 233. / Silicon SemiconductorTechnology by W. P. Runyan (1985)
  2. S. DANYLUK and S. W. LEE, in “ASM Handbook”, Vol. 18, “Friction, Lubrication andWearTechnology”, edited by P. J. Blau (ASM International, Metals Park, Ohio, 1992) p. 685. / Friction, Lubrication andWearTechnology by S. Danyluk (1992)
  3. ASTM F394-74T “Tentative Test Method for Biaxial Flexure Strength (Modulus of Rupture) of Ceramic Substrates”, (American Society for Testing and Materials, Philadelphia, PA, 1974).
  4. C. P. CHEN and M. H. LEIPOLD, Am. Ceram. Soc. Ceram. Bull. 59 (1980) 469. / Am. Ceram. Soc. Ceram. Bull. by C. P. Chen (1980)
  5. S. TIMOSHENKO and S. WOINOWSKY-KRIEGER, “Theory of Plates and Shells”, 2nd Edn (McGraw-Hill, New York, 1959). / Theory of Plates and Shells by S. Timoshenko (1959)
  6. Z. NADAI, Z. Physik 23 (1922) 366. / Z. Physik by Z. Nadai (1922)
  7. W. A. BASSALI, Proc. Cambridge Philos. Soc. 53 (1957) 728. (10.1017/S0305004100032795) / Proc. Cambridge Philos. Soc. by W. A. Bassali (1957)
  8. J. J. WORTMAN and R. A. EVANS, J. Appl. Phys. 36(1) (1965) 153. (10.1063/1.1713863) / J. Appl. Phys. by J. J. Wortman (1965)
  9. F. SHIMURA, “Semiconductor Silicon CrystalTechnology” (Academic Press, San Diego, 1989). / Semiconductor Silicon CrystalTechnology by F. Shimura (1989)
  10. W. WEIBULL, Acta Metall. 11 (1963) 725. (10.1016/0001-6160(63)90011-7) / Acta Metall. by W. Weibull (1963)
  11. RICHARD W. HERTZBERG, “Deformation and Fracture Mechanics of Engineering Materials”, 2nd Edn, (Wiley, New York, 1983). / Deformation and Fracture Mechanics of Engineering Materials by R. W. Hertzberg (1983)
  12. C. P. CHEN and M. LIEPOLD, in “Proceedings of the15th IEEE Photovoltaic Specialists Conference”, Kissimee, 1981 (IEEE, New York) p. 1122.
Dates
Type When
Created 22 years, 6 months ago (Feb. 6, 2003, 6:01 p.m.)
Deposited 2 months, 1 week ago (June 16, 2025, 7:50 a.m.)
Indexed 2 weeks, 4 days ago (Aug. 5, 2025, 8:50 a.m.)
Issued 28 years, 6 months ago (Feb. 1, 1997)
Published 28 years, 6 months ago (Feb. 1, 1997)
Published Online 28 years, 6 months ago (Feb. 1, 1997)
Published Print 28 years, 6 months ago (Feb. 1, 1997)
Funders 0

None

@article{McGUIRE_1997, title={The influence of backgrinding on the fracture strength of 100 mm diameter (1 1 1) p-type silicon wafers}, volume={32}, ISSN={1573-4803}, url={http://dx.doi.org/10.1023/a:1018530406568}, DOI={10.1023/a:1018530406568}, number={4}, journal={Journal of Materials Science}, publisher={Springer Science and Business Media LLC}, author={McGUIRE, K and DANYLUK, S and BAKER, T. L and RUPNOW, J. W and McLAUGHLIN, D}, year={1997}, month=feb, pages={1017–1024} }