DOI: 10.1021/jp3026545. Role of Interface on the Thermal Conductivity of Highly Filled Dielectric Epoxy/AlN Composites

Role of Interface on the Thermal Conductivity of Highly Filled Dielectric Epoxy/AlN Composites

10.1021/jp3026545

Crossref journal-article

American Chemical Society (ACS)

The Journal of Physical Chemistry C (316)

Bibliography

Huang, X., Iizuka, T., Jiang, P., Ohki, Y., & Tanaka, T. (2012). Role of Interface on the Thermal Conductivity of Highly Filled Dielectric Epoxy/AlN Composites. The Journal of Physical Chemistry C, 116(25), 13629â13639.

Authors 5

Xingyi Huang (first)
Tomonori Iizuka (additional)
Pingkai Jiang (additional)
Yoshimichi Ohki (additional)
Toshikatsu Tanaka (additional)

References 33 Referenced 429

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Dates

Type	When
Created	13 years, 3 months ago (June 5, 2012, 3:21 p.m.)
Deposited	2 years, 5 months ago (April 2, 2023, 9:32 p.m.)
Indexed	2 weeks, 1 day ago (Aug. 22, 2025, 12:51 a.m.)
Issued	13 years, 2 months ago (June 14, 2012)
Published	13 years, 2 months ago (June 14, 2012)
Published Online	13 years, 2 months ago (June 14, 2012)
Published Print	13 years, 2 months ago (June 28, 2012)

Funders 0

None

BibTeX

@article{Huang_2012, title={Role of Interface on the Thermal Conductivity of Highly Filled Dielectric Epoxy/AlN Composites}, volume={116}, ISSN={1932-7455}, url={http://dx.doi.org/10.1021/jp3026545}, DOI={10.1021/jp3026545}, number={25}, journal={The Journal of Physical Chemistry C}, publisher={American Chemical Society (ACS)}, author={Huang, Xingyi and Iizuka, Tomonori and Jiang, Pingkai and Ohki, Yoshimichi and Tanaka, Toshikatsu}, year={2012}, month=jun, pages={13629–13639} }

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