DOI: 10.1016/j.triboint.2014.07.003. On the cracks self-healing mechanism at ductile mode cutting of silicon

On the cracks self-healing mechanism at ductile mode cutting of silicon

10.1016/j.triboint.2014.07.003

Crossref journal-article

Elsevier BV

Tribology International (78)

Bibliography

Kovalchenko, A. M., & Milman, Yu. V. (2014). On the cracks self-healing mechanism at ductile mode cutting of silicon. Tribology International, 80, 166â171.

Authors 2

A.M. Kovalchenko (first)
Yu.V. Milman (additional)

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Dates

Type	When
Created	11 years, 1 month ago (July 17, 2014, 9:30 a.m.)
Deposited	6 years ago (Aug. 12, 2019, 3:05 p.m.)
Indexed	3 weeks, 3 days ago (Aug. 12, 2025, 6:17 p.m.)
Issued	10 years, 9 months ago (Dec. 1, 2014)
Published	10 years, 9 months ago (Dec. 1, 2014)
Published Print	10 years, 9 months ago (Dec. 1, 2014)

Funders 0

None

BibTeX

@article{Kovalchenko_2014, title={On the cracks self-healing mechanism at ductile mode cutting of silicon}, volume={80}, ISSN={0301-679X}, url={http://dx.doi.org/10.1016/j.triboint.2014.07.003}, DOI={10.1016/j.triboint.2014.07.003}, journal={Tribology International}, publisher={Elsevier BV}, author={Kovalchenko, A.M. and Milman, Yu.V.}, year={2014}, month=dec, pages={166–171} }

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