DOI: 10.1016/j.msea.2004.01.019. Joint reliability and high temperature stability of Sn–Ag–Bi lead-free solder with Cu and Sn

Joint reliability and high temperature stability of Sn–Ag–Bi lead-free solder with Cu and Sn–Pb/Ni/Cu substrates

10.1016/j.msea.2004.01.019

Crossref journal-article

Elsevier BV

Materials Science and Engineering: A (78)

Bibliography

Hwang, C.-W., & Suganuma, K. (2004). Joint reliability and high temperature stability of SnâAgâBi lead-free solder with Cu and SnâPb/Ni/Cu substrates. Materials Science and Engineering: A, 373(1â2), 187â194.

Authors 2

Chi-Won Hwang (first)
Katsuaki Suganuma (additional)

References 15 Referenced 23

10.1016/S1359-0286(00)00036-X / Curr. Opin. Solid State Mater. Sci. by Suganuma (2001)
10.1007/BF02651362 / J. Electron. Mater. by Kang (1994)
NCMS, Lead-free Solder Project Final Report, NCMS Report 0401RE96, National Center for Manufacturing Sciences, Ann Arbor, MI, 1997, pp. 1.1–2.14.
I. Karakaya, W.T. Thompson, in: T.B. Massalski, H. Okamoto, P.R. Subramanian, L. Kacprzak (Eds.), Binary Alloy Phase Diagram, 2nd ed., ASM International, Materials Park, OH, 1990, p. 94.
10.1007/BF02653345 / J. Electron. Mater. by Kattner (1994)
10.1007/s11664-999-0251-3 / J. Electron. Mater. by Vianco (1999)
10.1007/BF02651370 / J. Electron. Mater. by Artaki (1994)
10.1007/s11664-999-0250-4 / J. Electron. Mater. by Vianco (1999)
10.2320/jinstmet1952.59.12_1299 / J. Jpn. Inst. Met. by Suganuma (1995)
10.1007/s11664-000-0015-6 / J. Electron. Mater. by Chada (2000)
C.W. Hwang, K. Suganuma, in: Proceedings of the Electronics Goes Green 2000+, Berlin, Germany, September 11–13, 2000, VDE Verlag, Berlin, 2000, pp. 67–72.
10.1016/S0364-5916(98)00022-4 / Calphad by Yoon (1998)
10.1016/S1359-6454(00)00234-2 / Acta Mater. by Suganuma (2000)
10.1016/S1359-6462(03)00432-9 / Scripta Mater. by Lopez (2003)
10.1016/S1359-6462(97)00171-1 / Scripta Mater. by Chang (1997)

Dates

Type	When
Created	21 years, 4 months ago (April 26, 2004, 5:21 a.m.)
Deposited	3 years, 2 months ago (July 3, 2022, 6:44 a.m.)
Indexed	6 months, 2 weeks ago (Feb. 21, 2025, 1:01 a.m.)
Issued	21 years, 4 months ago (May 1, 2004)
Published	21 years, 4 months ago (May 1, 2004)
Published Print	21 years, 4 months ago (May 1, 2004)

Funders 1

Ministry of Education, Culture, Sports, Science and Technology 10.13039/501100001700
Region: Asia
gov (National government)
Labels3
1. Monbu-kagaku-shō
2. 文部科学省
3. MEXT

BibTeX

@article{Hwang_2004, title={Joint reliability and high temperature stability of Sn–Ag–Bi lead-free solder with Cu and Sn–Pb/Ni/Cu substrates}, volume={373}, ISSN={0921-5093}, url={http://dx.doi.org/10.1016/j.msea.2004.01.019}, DOI={10.1016/j.msea.2004.01.019}, number={1–2}, journal={Materials Science and Engineering: A}, publisher={Elsevier BV}, author={Hwang, Chi-Won and Suganuma, Katsuaki}, year={2004}, month=may, pages={187–194} }

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