DOI: 10.1016/j.microrel.2014.08.004. Low temperature FIB cross section: Application to indium micro bumps

Low temperature FIB cross section: Application to indium micro bumps

10.1016/j.microrel.2014.08.004

Crossref journal-article

Elsevier BV

Microelectronics Reliability (78)

Bibliography

Dantas de Morais, L., Chevalliez, S., & Mouleres, S. (2014). Low temperature FIB cross section: Application to indium micro bumps. Microelectronics Reliability, 54(9â10), 1802â1805.

Authors 3

L. Dantas de Morais (first)
S. Chevalliez (additional)
S. Mouleres (additional)

References 7 Referenced 15

Hooghan K, Young RJ. Focused ion beam (FIB) systems: a brief overview. In: Microelectronics failure analysis desk reference, ASM International, 6th ed.; 2011. p. 583–93.
{'key': '10.1016/j.microrel.2014.08.004_b0010', 'first-page': '12', 'article-title': 'Failure analysis of electronic material using cryogenic FIB-SEM', 'volume': '3', 'author': 'Antoniou', 'year': '2013', 'journal-title': 'Electron Dev Failure Anal'} / Electron Dev Failure Anal / Failure analysis of electronic material using cryogenic FIB-SEM by Antoniou (2013)
10.1017/S1431927612005090 / Microsc Microanal / Cryo-FIB of GaSb and InSb and temperature control effects on milling by Santeufemio (2012)
{'key': '10.1016/j.microrel.2014.08.004_b0020', 'series-title': 'Exploring cryogenic focused ion beam milling as a group III–V device fabrication tool', 'author': 'Commisso Dolph', 'year': '2013'} / Exploring cryogenic focused ion beam milling as a group III–V device fabrication tool by Commisso Dolph (2013)
Hartfield C, Antoniou N, Ditto J. Progress towards cryo FIB lift-out. In: 6th North America FIB-SEM workshop; 2013.
10.1007/BF02663677 / J Phase Equilibr / The Ga–In (gallium–indium) system by Anderson (1991)
Gerhardt M. <http://soft-matter.seas.harvard.edu/index.php/Eutectic_Gallium–Indium_%28EGaIn%29:_A_Liquid_Metal_Alloy_for_the_Formation_of_Stable_Structures_in_Microchannels_at_Room_Temperature>.

Dates

Type	When
Created	10 years, 11 months ago (Sept. 12, 2014, 8:17 p.m.)
Deposited	6 years, 10 months ago (Sept. 29, 2018, 5:52 p.m.)
Indexed	1 month, 1 week ago (July 11, 2025, 6:52 a.m.)
Issued	10 years, 11 months ago (Sept. 1, 2014)
Published	10 years, 11 months ago (Sept. 1, 2014)
Published Print	10 years, 11 months ago (Sept. 1, 2014)

Funders 0

None

BibTeX

@article{Dantas_de_Morais_2014, title={Low temperature FIB cross section: Application to indium micro bumps}, volume={54}, ISSN={0026-2714}, url={http://dx.doi.org/10.1016/j.microrel.2014.08.004}, DOI={10.1016/j.microrel.2014.08.004}, number={9–10}, journal={Microelectronics Reliability}, publisher={Elsevier BV}, author={Dantas de Morais, L. and Chevalliez, S. and Mouleres, S.}, year={2014}, month=sep, pages={1802–1805} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2025,
        7,
        11
      ]
    ],
    "date-time": "2025-07-11T10:52:35Z",
    "timestamp": 1752231155227
  },
  "reference-count": 7,
  "publisher": "Elsevier BV",
  "issue": "9-10",
  "license": [
    {
      "start": {
        "date-parts": [
          [
            2014,
            9,
            1
          ]
        ],
        "date-time": "2014-09-01T00:00:00Z",
        "timestamp": 1409529600000
      },
      "content-version": "tdm",
      "delay-in-days": 0,
      "URL": "https://www.elsevier.com/tdm/userlicense/1.0/"
    }
  ],
  "content-domain": {
    "domain": [
      "elsevier.com",
      "sciencedirect.com"
    ],
    "crossmark-restriction": true
  },
  "published-print": {
    "date-parts": [
      [
        2014,
        9
      ]
    ]
  },
  "DOI": "10.1016/j.microrel.2014.08.004",
  "type": "journal-article",
  "created": {
    "date-parts": [
      [
        2014,
        9,
        13
      ]
    ],
    "date-time": "2014-09-13T00:17:33Z",
    "timestamp": 1410567453000
  },
  "page": "1802-1805",
  "update-policy": "http://dx.doi.org/10.1016/elsevier_cm_policy",
  "source": "Crossref",
  "is-referenced-by-count": 15,
  "title": "Low temperature FIB cross section: Application to indium micro bumps",
  "prefix": "10.1016",
  "volume": "54",
  "author": [
    {
      "given": "L.",
      "family": "Dantas de Morais",
      "sequence": "first",
      "affiliation": []
    },
    {
      "given": "S.",
      "family": "Chevalliez",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "S.",
      "family": "Mouleres",
      "sequence": "additional",
      "affiliation": []
    }
  ],
  "member": "78",
  "reference": [
    {
      "key": "10.1016/j.microrel.2014.08.004_b0005",
      "unstructured": "Hooghan K, Young RJ. Focused ion beam (FIB) systems: a brief overview. In: Microelectronics failure analysis desk reference, ASM International, 6th ed.; 2011. p. 583\u201393."
    },
    {
      "key": "10.1016/j.microrel.2014.08.004_b0010",
      "first-page": "12",
      "article-title": "Failure analysis of electronic material using cryogenic FIB-SEM",
      "volume": "3",
      "author": "Antoniou",
      "year": "2013",
      "journal-title": "Electron Dev Failure Anal"
    },
    {
      "issue": "S2",
      "key": "10.1016/j.microrel.2014.08.004_b0015",
      "doi-asserted-by": "crossref",
      "first-page": "648",
      "DOI": "10.1017/S1431927612005090",
      "article-title": "Cryo-FIB of GaSb and InSb and temperature control effects on milling",
      "volume": "18",
      "author": "Santeufemio",
      "year": "2012",
      "journal-title": "Microsc Microanal"
    },
    {
      "key": "10.1016/j.microrel.2014.08.004_b0020",
      "series-title": "Exploring cryogenic focused ion beam milling as a group III\u2013V device fabrication tool",
      "author": "Commisso Dolph",
      "year": "2013"
    },
    {
      "key": "10.1016/j.microrel.2014.08.004_b0025",
      "unstructured": "Hartfield C, Antoniou N, Ditto J. Progress towards cryo FIB lift-out. In: 6th North America FIB-SEM workshop; 2013."
    },
    {
      "issue": "1",
      "key": "10.1016/j.microrel.2014.08.004_b0030",
      "doi-asserted-by": "crossref",
      "first-page": "64",
      "DOI": "10.1007/BF02663677",
      "article-title": "The Ga\u2013In (gallium\u2013indium) system",
      "volume": "12",
      "author": "Anderson",
      "year": "1991",
      "journal-title": "J Phase Equilibr"
    },
    {
      "key": "10.1016/j.microrel.2014.08.004_b0035",
      "unstructured": "Gerhardt M. <http://soft-matter.seas.harvard.edu/index.php/Eutectic_Gallium\u2013Indium_%28EGaIn%29:_A_Liquid_Metal_Alloy_for_the_Formation_of_Stable_Structures_in_Microchannels_at_Room_Temperature>."
    }
  ],
  "container-title": "Microelectronics Reliability",
  "original-title": [],
  "language": "en",
  "link": [
    {
      "URL": "https://api.elsevier.com/content/article/PII:S0026271414003643?httpAccept=text/xml",
      "content-type": "text/xml",
      "content-version": "vor",
      "intended-application": "text-mining"
    },
    {
      "URL": "https://api.elsevier.com/content/article/PII:S0026271414003643?httpAccept=text/plain",
      "content-type": "text/plain",
      "content-version": "vor",
      "intended-application": "text-mining"
    }
  ],
  "deposited": {
    "date-parts": [
      [
        2018,
        9,
        29
      ]
    ],
    "date-time": "2018-09-29T21:52:14Z",
    "timestamp": 1538257934000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "https://linkinghub.elsevier.com/retrieve/pii/S0026271414003643"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        2014,
        9
      ]
    ]
  },
  "references-count": 7,
  "journal-issue": {
    "issue": "9-10",
    "published-print": {
      "date-parts": [
        [
          2014,
          9
        ]
      ]
    }
  },
  "alternative-id": [
    "S0026271414003643"
  ],
  "URL": "http://dx.doi.org/10.1016/j.microrel.2014.08.004",
  "relation": {},
  "ISSN": [
    "0026-2714"
  ],
  "subject": [],
  "container-title-short": "Microelectronics Reliability",
  "published": {
    "date-parts": [
      [
        2014,
        9
      ]
    ]
  },
  "assertion": [
    {
      "value": "Elsevier",
      "name": "publisher",
      "label": "This article is maintained by"
    },
    {
      "value": "Low temperature FIB cross section: Application to indium micro bumps",
      "name": "articletitle",
      "label": "Article Title"
    },
    {
      "value": "Microelectronics Reliability",
      "name": "journaltitle",
      "label": "Journal Title"
    },
    {
      "value": "https://doi.org/10.1016/j.microrel.2014.08.004",
      "name": "articlelink",
      "label": "CrossRef DOI link to publisher maintained version"
    },
    {
      "value": "article",
      "name": "content_type",
      "label": "Content Type"
    },
    {
      "value": "Copyright \u00a9 2014 Elsevier Ltd. All rights reserved.",
      "name": "copyright",
      "label": "Copyright"
    }
  ]
}