DOI: 10.1016/j.microrel.2013.07.116. Repairing bonding wire connections using a microsoldering unit inside an SEM

Repairing bonding wire connections using a microsoldering unit inside an SEM

10.1016/j.microrel.2013.07.116

Crossref journal-article

Elsevier BV

Microelectronics Reliability (78)

Bibliography

Rummel, A., Schock, K., Kemmler, M., Smith, A., & Kleindiek, S. (2013). Repairing bonding wire connections using a microsoldering unit inside an SEM. Microelectronics Reliability, 53(9â11), 1427â1429.

Authors 5

Andreas Rummel (first)
Klaus Schock (additional)
Matthias Kemmler (additional)
Andrew Smith (additional)
Stephan Kleindiek (additional)

References 1 Referenced 1

Andreas Rummel, Klaus Schock, Andrew Smith, Stephan Kleindiek. A new approach for making electrically conductive interconnections between small contacts in failure analysis. ESREF; 2011, poster. (10.1016/j.microrel.2012.06.050)

Dates

Type	When
Created	11 years, 11 months ago (Aug. 25, 2013, 7:17 a.m.)
Deposited	3 years, 5 months ago (March 4, 2022, 3:44 p.m.)
Indexed	3 years, 4 months ago (April 5, 2022, 6:53 p.m.)
Issued	11 years, 11 months ago (Sept. 1, 2013)
Published	11 years, 11 months ago (Sept. 1, 2013)
Published Print	11 years, 11 months ago (Sept. 1, 2013)

Funders 0

None

BibTeX

@article{Rummel_2013, title={Repairing bonding wire connections using a microsoldering unit inside an SEM}, volume={53}, ISSN={0026-2714}, url={http://dx.doi.org/10.1016/j.microrel.2013.07.116}, DOI={10.1016/j.microrel.2013.07.116}, number={9–11}, journal={Microelectronics Reliability}, publisher={Elsevier BV}, author={Rummel, Andreas and Schock, Klaus and Kemmler, Matthias and Smith, Andrew and Kleindiek, Stephan}, year={2013}, month=sep, pages={1427–1429} }

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