DOI: 10.1016/j.microrel.2010.09.031. Reliability challenges in 3D IC packaging technology

Reliability challenges in 3D IC packaging technology

10.1016/j.microrel.2010.09.031

Crossref journal-article

Elsevier BV

Microelectronics Reliability (78)

Bibliography

Tu, K. N. (2011). Reliability challenges in 3D IC packaging technology. Microelectronics Reliability, 51(3), 517â523.

Authors 1

K.N. Tu (first)

References 20 Referenced 565

10.1016/j.mee.2009.07.022 / Microelectron Eng / Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integrated circuits by Ladani (2010)
Selvanayagam Cheryl S, Lau John H, Zhang Xiaowu, Seah SKW, Vaidyanathan Kripesh, Chai TC. Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps. In: Proceedings of 2008 electronic components and technology conference. p. 1073–81. (10.1109/ECTC.2008.4550108)
Khan Navas, Rao Vempati Srinivasa, Lim Samule, We Ho Soon, Lee Vincent, Wu Zhang Xiao et al. Development of 3D silicon module with TSV for system in packaging. In: Proceedings of 2008 electronic components and technology conference. p. 550–5. (10.1109/ECTC.2008.4550027)
Hsieh Ming-Che, Yu Chih-Kuang. Thermo-mechanical simulations for 4-layer stacked IC packages. In: 9th Int conf on thermal, mechanical and multiphysics simulation and experiments in micro-electronics and micro-systems, EuroSimE; 2008.
Yu Aibin, Lau John H, Ho Soon Wee, Kumar Aditya, Hnin Wai Yin, Yu Da-Quan, et al. Study of 15μm pitch solder microbumps for 3D IC Integration. In: Proceedings of 2009 electronic components and technology conference. p. 6–10. (10.1109/ECTC.2009.5073988)
Lee Jin Soo, Byun Kwang Yoo, Chung Qwan Ho, Suh Min Suk, Kim Seong Cheol, Kim Young-Ho. Chip to chip bonding using micro-cu bumps with sn capping layers. In: Proceedings of 2009 European microelectronics and packaging conference. p. 1–5.
Zhan Chau-Jie, Chang Jing-Yao, Chang Tao-Chih, Tsai Tsung-Fu. Bonding and electromigration of 30μm fine pitch micro-bump interconnection. In: Proceedings of 4th international conference on microsystems, packaging, assembly and circuits technology conference; 2009. (10.1109/IMPACT.2009.5382156)
10.1016/j.mee.2006.09.026 / Microelectron Eng / Microcontacts with sub-30 lm pitch for 3D chip-on-chip integration by Huebner (2006)
10.1063/1.2432284 / Appl Phys Lett / Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins by Xu (2007)
{'key': '10.1016/j.microrel.2010.09.031_b0050', 'article-title': 'Fabrication and evaluation of 3D packages with through hole via', 'volume': '970', 'author': 'Jang', 'year': '2007', 'journal-title': 'Mater Res Soc Sym Proc'} / Mater Res Soc Sym Proc / Fabrication and evaluation of 3D packages with through hole via by Jang (2007)
Beyne E, De Moor P, Ruythooren W, Labie R, Jourdain A, Tilmans H, et al. Through-silicon via and die stacking technologies for microsystems-integration. In: I EEE international electron devices meeting, IEDM; 2008. (10.1109/IEDM.2008.4796734)
Sakuma K, Andry PS, Dang B, Maria J, Tsang CK, Patel C, et al. 3D Chip stacking technology with low-volume lead-free interconnections. In: Proceedings of 2007 electronic components and technology conference. p. 627–32. (10.1109/ECTC.2007.373862)
{'key': '10.1016/j.microrel.2010.09.031_b0065', 'series-title': 'Solder joint technology', 'author': 'Tu', 'year': '2007'} / Solder joint technology by Tu (2007)
10.1016/j.microrel.2009.02.007 / Microelectron Reliab / Edited a special section on recent research advances in Pb-free solders by Lai (2009)
10.1146/annurev.matsci.38.060407.130253 / Ann Rev Mater Res / Electromigration and thermomigrtaion in Pb-free flip chip solder joints by Chen (2010)
{'issue': '2', 'key': '10.1016/j.microrel.2010.09.031_b0080', 'first-page': '132', 'article-title': 'Thermomigration in flip chip solder joints', 'volume': '2', 'author': 'Tian', 'year': '2009', 'journal-title': 'ASE Technol J'} / ASE Technol J / Thermomigration in flip chip solder joints by Tian (2009)
{'key': '10.1016/j.microrel.2010.09.031_b0085', 'series-title': 'Electronic thin film reliability', 'author': 'Tu', 'year': '2010'} / Electronic thin film reliability by Tu (2010)
10.1063/1.2822446 / Appl Phys Lett / Effect of current crowding on whisker growth at the anode in lip chip solder joints by Ouyang (2007)
10.1063/1.3309750 / J Appl Phys / High precision thermal stress study on flip chips by synchrotron polychromatic X-ray microdiffraction by Chen (2010)
10.1063/1.3157196 / J Appl Phys / In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction by Chen (2009)

Dates

Type	When
Created	14 years, 9 months ago (Oct. 26, 2010, 12:35 a.m.)
Deposited	6 years, 2 months ago (June 5, 2019, 2 p.m.)
Indexed	18 hours, 11 minutes ago (Aug. 20, 2025, 9:13 a.m.)
Issued	14 years, 5 months ago (March 1, 2011)
Published	14 years, 5 months ago (March 1, 2011)
Published Print	14 years, 5 months ago (March 1, 2011)

Funders 0

None

BibTeX

@article{Tu_2011, title={Reliability challenges in 3D IC packaging technology}, volume={51}, ISSN={0026-2714}, url={http://dx.doi.org/10.1016/j.microrel.2010.09.031}, DOI={10.1016/j.microrel.2010.09.031}, number={3}, journal={Microelectronics Reliability}, publisher={Elsevier BV}, author={Tu, K.N.}, year={2011}, month=mar, pages={517–523} }

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