DOI: 10.1016/j.mee.2006.09.026. Microcontacts with sub-30μm pitch for 3D chip-on-chip integration

Microcontacts with sub-30μm pitch for 3D chip-on-chip integration

10.1016/j.mee.2006.09.026

Crossref journal-article

Elsevier BV

Microelectronic Engineering (78)

Bibliography

Huebner, H., Penka, S., Barchmann, B., Eigner, M., Gruber, W., Nobis, M., Janka, S., Kristen, G., & Schneegans, M. (2006). Microcontacts with sub-30Î¼m pitch for 3D chip-on-chip integration. Microelectronic Engineering, 83(11â12), 2155â2162.

Authors 9

H. Huebner (first)
S. Penka (additional)
B. Barchmann (additional)
M. Eigner (additional)
W. Gruber (additional)
M. Nobis (additional)
S. Janka (additional)
G. Kristen (additional)
M. Schneegans (additional)

References 4 Referenced 72

{'key': '10.1016/j.mee.2006.09.026_bib1', 'series-title': 'Flip Chip Technologies', 'isbn-type': 'print', 'year': '1995', 'ISBN': 'http://id.crossref.org/isbn/0070366098'} / Flip Chip Technologies (1995)
R. Bauer, B. Ebersberger, C. Kupfer, L. Alexa, Reliability investigations on SnAg bumps on substrate pads with different pad finish, AIP Conference Proceedings, Vol. 817, Melville, New York, 2006, pp. 360–365. (10.1063/1.2173569)
S. Bader, Erzeugung thermisch stabiler Mikroverbindungen durch Isotherme Erstarrung, Thesis, Institut für Metallkunde and MPI für Metallforschung Stuttgart, 1990.
H. Huebner, O. Ehrmann, M. Eigner, W. Gruber, A. Klumpp, R. Merkel, P. Ramm, M. Roth, J. Weber, R.Wieland, Face-to-face chip integration with full metal interface, Advanced Metallization Conference 2002, San Diego.

Dates

Type	When
Created	18 years, 10 months ago (Oct. 18, 2006, 12:21 p.m.)
Deposited	6 years, 3 months ago (April 21, 2019, 2:24 p.m.)
Indexed	2 months, 3 weeks ago (May 30, 2025, 1:02 a.m.)
Issued	18 years, 9 months ago (Nov. 1, 2006)
Published	18 years, 9 months ago (Nov. 1, 2006)
Published Print	18 years, 9 months ago (Nov. 1, 2006)

Funders 0

None

BibTeX

@article{Huebner_2006, title={Microcontacts with sub-30μm pitch for 3D chip-on-chip integration}, volume={83}, ISSN={0167-9317}, url={http://dx.doi.org/10.1016/j.mee.2006.09.026}, DOI={10.1016/j.mee.2006.09.026}, number={11–12}, journal={Microelectronic Engineering}, publisher={Elsevier BV}, author={Huebner, H. and Penka, S. and Barchmann, B. and Eigner, M. and Gruber, W. and Nobis, M. and Janka, S. and Kristen, G. and Schneegans, M.}, year={2006}, month=nov, pages={2155–2162} }

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