DOI: 10.1016/j.jeurceramsoc.2005.07.027. Effects of processing method and additive composition on microstructure and thermal conductivity of Si3N4 ceramics

Effects of processing method and additive composition on microstructure and thermal conductivity of Si3N4 ceramics

10.1016/j.jeurceramsoc.2005.07.027

Crossref journal-article

Elsevier BV

Journal of the European Ceramic Society (78)

Bibliography

Zhu, X., Zhou, Y., & Hirao, K. (2006). Effects of processing method and additive composition on microstructure and thermal conductivity of Si3N4 ceramics. Journal of the European Ceramic Society, 26(4â5), 711â718.

Authors 3

Xinwen Zhu (first)
You Zhou (additional)
Kiyoshi Hirao (additional)

References 26 Referenced 63

10.1111/j.1151-2916.2000.tb01182.x / J. Am. Ceram. Soc. / Silicon nitride and related materials by Riley (2000)
10.1002/9780470314715.ch52 / Ceram. Eng. Sci. Proc. / Opportunities for enhancing the thermal conductivity of SiC and Si3N4 ceramics through improved processing by Haggerty (1995)
10.1103/PhysRevB.65.134110 / Phys. Rev. B / Molecular dynamics calculation of the ideal thermal conductivity of single-crystal α- and β-Si3N4 by Hirosaki (2002)
10.1557/mrs2001.115 / MRS Bull. / High thermal conductivity silicon nitride by Hirao (2001)
10.1007/BF01161167 / J. Mater. Sci. / Relationships between processing, microstructure, and properties of dense and reaction-bonded silicon nitride by Ziegler (1987)
10.2320/matertrans1989.41.312 / Mater. Trans., JIM / Microstructure characterization of GPSed-RBSN and GPSed-Si3N4 ceramics by Lee (2000)
10.1016/S0272-8842(03)00034-8 / Ceram. Int. / Effect of β-Si3N4 seed particles on the property of sintered reaction-bonded silicon nitride by Lee (2003)
10.1111/j.1151-2916.2004.tb07747.x / J. Am. Ceram. Soc. / Effect of sintering additive composition on the processing and thermal conductivity of sintered reaction-bonded Si3N4 by Zhu (2004)
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10.1007/BF00729365 / J. Mater. Sci. Lett. / Quantitative phase analysis of Si3N4 by X-ray diffraction by Pigeon (1992)
10.1007/BF00561287 / J. Mater. Sci. / Reaction-bonded silicon nitride: its formation and properties by Moulson (1979)
10.1007/BF00551961 / J. Mater. Sci. / On reactions between silicon and nitrogen. Part 1. Mechanisms by Jennings (1983)
10.1007/BF00595765 / J. Mater. Sci. / Some factors influencing the formation of reaction-bonded silicon nitride by Pigeon (1993)
10.1111/j.1151-2916.1989.tb06082.x / J. Am. Ceram. Soc. / Influlence of crystalline secondary phases on the densification behavior of reacion-bonded silicon nitride during postsintering under increased nitrogen pressure by Kleebe (1989)
10.1023/B:JMSC.0000040090.33370.66 / J. Mater. Sci. / Post-densification behaviour of reaction-bonded silicon nitride (RBSN): effects of various characteristics of RBSN by Zhu (2004)
10.1111/j.1151-2916.2001.tb00662.x / J. Am. Ceram. Soc. / Thermal conductivity of β-Si3N4. III. Effect of rare-earth (RE=La, Nd, Gd, Y, Yb, and Sc) oxide additives by Kitayama (2001)
10.1016/S0955-2219(97)00057-5 / J. Eur. Ceram. Soc. / Formation of Ln–Si–Al–O–N glasses and their properties by Ramesh (1997)
10.1016/0955-2219(95)00175-1 / J. Eur. Ceram. Soc. / Model experiments concerning abnormal grain growth in silicon nitride by Dressler (1996)
10.1016/S0955-2219(96)00139-2 / J. Eur. Ceram. Soc. / Control and characterization of abnormally grown grains in silicon nitride ceramics by Emoto (1997)
10.1111/j.1151-2916.2000.tb01501.x / J. Am. Ceram. Soc. / Thermal conductivity of β-Si3N4. II. Effect of lattice oxygen by Kitayama (2000)
10.1111/j.1151-2916.1999.tb02209.x / J. Am. Ceram. Soc. / Thermal conductivity of β-Si3N4. I. Effect of various microstructural factors by Kitayama (1999)
10.1111/j.1151-2916.1999.tb01835.x / J. Am. Ceram. Soc. / Effect of grain size on the thermal conductivity of Si3N4 by Watari (1999)
10.1016/S0955-2219(02)00291-1 / J. Eur. Ceram. Soc. / Effect of large β-Si3N4 particles on the thermal conductivity of β-Si3N4 ceramics by Yokota (2003)
10.1016/S0955-2219(02)00292-3 / J. Eur. Ceram. Soc. / Effect of the addition of β-Si3N4 nuclei on the thermal conductivity of β-Si3N4 ceramics by Yokota (2003)
10.1111/j.1151-2916.1996.tb08549.x / J. Am. Ceram. Soc. / Morphological effect of second phase on the thermal conductivity of AlN ceramics by Kim (1996)
10.1016/S0921-5093(01)01936-0 / Mater. Sci. Eng. A / On the effects of secondary phase on thermal conductivity of AlN ceramic substrates using a microstructural modelling approach by Boey (2002)

Dates

Type	When
Created	20 years ago (Aug. 12, 2005, 4:15 a.m.)
Deposited	6 years, 6 months ago (Jan. 23, 2019, 9:53 a.m.)
Indexed	1 month, 2 weeks ago (July 3, 2025, 8:53 a.m.)
Issued	19 years, 7 months ago (Jan. 1, 2006)
Published	19 years, 7 months ago (Jan. 1, 2006)
Published Print	19 years, 7 months ago (Jan. 1, 2006)

Funders 0

None

BibTeX

@article{Zhu_2006, title={Effects of processing method and additive composition on microstructure and thermal conductivity of Si3N4 ceramics}, volume={26}, ISSN={0955-2219}, url={http://dx.doi.org/10.1016/j.jeurceramsoc.2005.07.027}, DOI={10.1016/j.jeurceramsoc.2005.07.027}, number={4–5}, journal={Journal of the European Ceramic Society}, publisher={Elsevier BV}, author={Zhu, Xinwen and Zhou, You and Hirao, Kiyoshi}, year={2006}, month=jan, pages={711–718} }

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