Crossref journal-article
Elsevier BV
International Journal of Machine Tools and Manufacture (78)
Bibliography

Zong, W. J., Sun, T., Li, D., Cheng, K., & Liang, Y. C. (2008). XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer. International Journal of Machine Tools and Manufacture, 48(15), 1678–1687.

Authors 5
  1. W.J. Zong (first)
  2. T. Sun (additional)
  3. D. Li (additional)
  4. K. Cheng (additional)
  5. Y.C. Liang (additional)
References 33 Referenced 89
  1. 10.1023/A:1006694310171 / Journal of Materials Science Letters / Ductile and brittle modes in single-point-diamond-turning of silicon probed by Raman scattering by Pizani (1999)
  2. 10.1007/s001700070004 / International Journal of Advanced Manufacturing Technology / Effect of crystalline orientation in the ductile-regime machining of silicon by Hung (2000)
  3. 10.1016/S0020-7403(01)00024-8 / International Journal of Mechanical Sciences / Towards a deeper understanding of plastic deformation in mono-crystalline silicon by Zhang (2001)
  4. 10.1016/S0921-5093(00)01031-5 / Materials Science and Engineering / On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications by Yan (2001)
  5. 10.1016/0301-679X(95)00019-Z / Tribology International / Energy scaling transitions in machining of silicon by diamond by Puttick (1995)
  6. 10.1016/S0924-0136(98)00090-9 / Journal of Materials Processing Technology / Effect of ultraprecision grinding on the microstructural change in silicon monocrystals by Zarudi (1998)
  7. 10.1016/S0043-1648(98)00378-0 / Wear / An understanding of the chemical effect on the nano-wear deformation in mono-crystalline silicon components by Zhang (1999)
  8. 10.1016/S0924-0136(01)01218-3 / Journal of Materials Processing Technology / Ductile regime turning at large tool feed by Yan (2002)
  9. 10.1016/S0022-3093(00)00236-2 / Journal of Non-Crystalline Solids / Surface amorphization in diamond turning of silicon crystal investigated by transmission electron microscopy by Jasinevicius (2000)
  10. 10.1016/S0141-6359(00)00069-6 / Precision Engineering / An empirical survey on the influence of machining parameters on tool wear in diamond turning of large single-crystal silicon optics by Born (2001)
  11. 10.1016/S0924-0136(02)00124-3 / Journal of Materials Processing Technology / Ductile behaviour in single-point diamond-turning of single-crystal silicon by Chao (2002)
  12. 10.1007/s00170-003-1593-2 / International Journal of Advanced Manufacturing Technology / An experimental study of edge radius effect on cutting single crystal silicon by Fang (2003)
  13. 10.1016/S0043-1648(03)00076-0 / Wear / Some observations on the wear of diamond tools in ultra-precision cutting of single-crystal silicon by Yan (2003)
  14. 10.1016/j.wear.2004.03.012 / Wear / Effect of crystallographic orientation on wear of diamond tools for nano-scale ductile cutting of silicon by Uddin (2004)
  15. 10.1016/j.wear.2004.12.020 / Wear / Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer by Li (2005)
  16. {'key': '10.1016/j.ijmachtools.2008.06.008_bib16', 'article-title': 'Annealing treatment of amorphous silicon generated by single point diamond turning', 'author': 'Jasinevicius', 'year': '2006', 'journal-title': 'International Journal of Advanced Manufacturing Technology'} / International Journal of Advanced Manufacturing Technology / Annealing treatment of amorphous silicon generated by single point diamond turning by Jasinevicius (2006)
  17. 10.1007/s00170-005-0245-0 / International Journal of Advanced Manufacturing Technology / The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer by Arefin (2007)
  18. 10.1007/s00170-005-0364-7 / International Journal of Advanced Manufacturing Technology / A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers by Liu (2007)
  19. 10.1016/j.wear.2006.05.022 / Wear / 3D characterisation of tool wear whilst diamond turning silicon by Cardenas (2007)
  20. 10.1115/1.2673567 / Journal of Manufacturing Science and Engineering / Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon by Cai (2007)
  21. 10.1016/S0020-7683(03)00119-7 / International Journal of Solids and Structures / A mechanics prediction of the behaviour of mono-crystalline silicon under nano-indentation by Vodenitcharova (2003)
  22. 10.1088/0957-4484/15/5/049 / Nanotechnology / Atomistic simulations of structural transformation of silicon surfaces under nanoindentation by Sanz-Navarro (2004)
  23. 10.1016/0254-0584(95)01673-I / Materials Chemistry and Physics / Carbon-mediated effects in silicon and in silicon-related materials by Skorupa (1996)
  24. 10.1016/S0921-5093(99)00077-5 / Materials Science and Engineering / Fracture anisotropy in silicon single crystal by Ebrahimi (1999)
  25. 10.1016/j.diamond.2005.10.066 / Diamond and Related Materials / Contact accuracy and orientations affecting tool sharpness of diamond cutting tools by mechanical lapping by Zong (2006)
  26. 10.1016/j.diamond.2005.01.020 / Diamond and Related Materials / Characterisation of a-C:H and oxygen-containing Si:C:H films by Raman spectroscopy and XPS by Veres (2005)
  27. 10.1016/S0368-2048(00)00180-8 / Journal of Electron Spectroscopy and Related Phenomena / Structural determination of sintered Si3N4/SiC nanocomposite using the XPS differential charge effect by Ténégal (2000)
  28. 10.1016/j.susc.2005.03.010 / Surface Science / XPS and STM study of SiC synthesized by acetylene and disilane reaction with the Si(100)2×1 surface by Santoni (2005)
  29. P. Cristian, Kinetics of diamond–silicon reaction under high pressure–high temperature conditions, Ph.D. Dissertation, Texas Christian University, 2004.
  30. 10.1016/S0301-679X(98)00064-4 / Tribology International / Atomic scale deformation in silicon monocrystals induced by two-body and three body contact sliding by Zhang (1998)
  31. 10.1016/S0925-9635(97)00269-0 / Diamond and Related Materials / The re-arrangement of broken bonds in damaged diamond: graphitization versus annealing back to diamond by Reznik (1998)
  32. 10.1016/j.ijmachtools.2004.11.014 / International Journal of Machine Tools and Manufacture / The material removal mechanism in mechanical lapping of diamond cutting tools by Zong (2005)
  33. 10.1016/S0043-1648(03)00178-9 / Wear / Modeling and simulation of the tool wear in nanometric cutting by Cheng (2003)
Dates
Type When
Created 17 years, 2 months ago (June 23, 2008, 12:22 p.m.)
Deposited 6 years, 7 months ago (Dec. 27, 2018, 1:23 p.m.)
Indexed 4 weeks, 2 days ago (July 27, 2025, 3:15 a.m.)
Issued 16 years, 8 months ago (Dec. 1, 2008)
Published 16 years, 8 months ago (Dec. 1, 2008)
Published Print 16 years, 8 months ago (Dec. 1, 2008)
Funders 0

None

@article{Zong_2008, title={XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer}, volume={48}, ISSN={0890-6955}, url={http://dx.doi.org/10.1016/j.ijmachtools.2008.06.008}, DOI={10.1016/j.ijmachtools.2008.06.008}, number={15}, journal={International Journal of Machine Tools and Manufacture}, publisher={Elsevier BV}, author={Zong, W.J. and Sun, T. and Li, D. and Cheng, K. and Liang, Y.C.}, year={2008}, month=dec, pages={1678–1687} }