DOI: 10.1016/s1369-8001(02)00124-5. Physical failure analysis in semiconductor industry—challenges of the copper interconnect process

Physical failure analysis in semiconductor industry—challenges of the copper interconnect process

10.1016/s1369-8001(02)00124-5

Crossref journal-article

Elsevier BV

Materials Science in Semiconductor Processing (78)

Bibliography

Zschech, E., Langer, E., Engelmann, H.-J., & Dittmar, K. (2002). Physical failure analysis in semiconductor industryâchallenges of the copper interconnect process. Materials Science in Semiconductor Processing, 5(4â5), 457â464.

Authors 4

Ehrenfried Zschech (first)
Eckhard Langer (additional)
Hans-Juergen Engelmann (additional)
Kornelia Dittmar (additional)

References 13 Referenced 18

International Technology Roadmap for Semiconductors, Semiconductor International Association, 2001.
Diebold AC, Goodall RK. Proceedings of the International Interconnect Technology Conference IITC, San Francisco, 1999. p. 77.
{'key': '10.1016/S1369-8001(02)00124-5_BIB3', 'first-page': '803', 'volume': '92', 'author': 'Zschech', 'year': '2001', 'journal-title': 'Z Metallkd'} / Z Metallkd by Zschech (2001)
10.1016/S0026-2714(00)00107-4 / Microelectron Reliab by Engelmann (2000)
10.1063/1.332840 / J Appl Phys by Seiler (1983)
Nikawa K, Inoue S. Proceedings of the Asian Testing Symposium AST, Akita, 1997. p. 214–19.
Engelmann HJ, Zschech E. International Conference on Characterization and Metrology for ULSI Technology. AIP Conf Proc (Amer Inst Phys) 2000;550:491–9.
10.1515/pm-2001-380803 / Prakt Metallogr by Zschech (2001)
Mardinly J. Microscopic and Microanalysis Meeting, Long Beach 2001, unpublished.
Stegmann H, Engelmann HJ, Zschech E. Microelectron Eng 2002;65 (1–2). (10.1016/S0167-9317(02)00849-3)
{'key': '10.1016/S1369-8001(02)00124-5_BIB11', 'first-page': '323', 'volume': '1', 'author': 'Diebold', 'year': '1997', 'journal-title': 'Future Fab Int'} / Future Fab Int by Diebold (1997)
10.1002/sia.1063 / Surf Interf Anal by Stevie (2001)
Weiland R, Boit C, Dawes N, Dziesiaty A, Demm E, Ebersberger B, Frey L, Geyer S, Hirsch A, Lehrer C, Meis P, Kamolz M, Lezec H, Rettenmaier H, Tittes W, Treichler R, Zimmermann H. International Symposium for Testing and Failure Analysis (ISTFA), Bellevue Washington, 2000. p. 393–6. (10.31399/asm.cp.istfa2000p0393)

Dates

Type	When
Created	22 years, 4 months ago (April 4, 2003, 9:09 p.m.)
Deposited	8 months, 2 weeks ago (Dec. 11, 2024, 5:01 p.m.)
Indexed	1 month ago (July 26, 2025, 4:44 a.m.)
Issued	23 years ago (Aug. 1, 2002)
Published	23 years ago (Aug. 1, 2002)
Published Print	23 years ago (Aug. 1, 2002)

Funders 0

None

BibTeX

@article{Zschech_2002, title={Physical failure analysis in semiconductor industry—challenges of the copper interconnect process}, volume={5}, ISSN={1369-8001}, url={http://dx.doi.org/10.1016/s1369-8001(02)00124-5}, DOI={10.1016/s1369-8001(02)00124-5}, number={4–5}, journal={Materials Science in Semiconductor Processing}, publisher={Elsevier BV}, author={Zschech, Ehrenfried and Langer, Eckhard and Engelmann, Hans-Juergen and Dittmar, Kornelia}, year={2002}, month=aug, pages={457–464} }

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